# Hot Chips 2026: Samsung and HBM Base Die Opportunities

DevFeed: [Hot Chips 2026: Samsung and HBM Base Die Opportunities](<https://devfeed.tech/articles/hot-chips-2026-samsung-and-hbm-base-die-opportunities-13997.md>)

Original publisher: [Read original article](<https://chipsandcheese.com/p/hot-chips-2026-samsung-and-hbm-base>)

Author: Chester Lam

Published: 2026-08-23T19:01:23Z

Content type: news

Language: en

Sources: [Chips and Cheese](<https://devfeed.tech/sources/chips-and-cheese.md>)

Topics: [samsung](<https://devfeed.tech/topics/samsung.md>)

Tags: [capacity](<https://devfeed.tech/tags/capacity.md>), [cpu](<https://devfeed.tech/tags/cpu.md>), [intel](<https://devfeed.tech/tags/intel.md>), [machine-learning](<https://devfeed.tech/tags/machine-learning.md>), [memory](<https://devfeed.tech/tags/memory.md>), [samsung](<https://devfeed.tech/tags/samsung.md>)

## AI overview

The article discusses Samsung's HBM base-die design. Samsung moved HBM4 and HBM4E base dies to a 4nm logic process, creating additional usable area and enabling potential optimizations such as moving the memory controller onto the HBM base die.

## Source excerpt

Machine learning applications demand ever more memory capacity and bandwidth. Samsung responded by fabricating their HBM base dies on a logic node, which opens up more opportunities