# Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)

DevFeed: [Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)](<https://devfeed.tech/articles/open-benchmark-evaluates-ai-thermal-models-for-2-5d-and-3d-ics-uts-tu-munich-shanghaitech-55471.md>)

Original publisher: [Read original article](<https://semiengineering.com/open-benchmark-evaluates-ai-thermal-models-for-2-5d-and-3d-ics-uts-tu-munich-shanghaitech/>)

Author: Technical Paper Link

Published: 2026-09-19T18:37:45Z

Content type: news

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Benchmark](<https://devfeed.tech/topics/benchmark.md>), [Artificial Intelligence](<https://devfeed.tech/topics/ai.md>), [3D](<https://devfeed.tech/topics/3d.md>)

Tags: [2-5d-ic](<https://devfeed.tech/tags/2-5d-ic.md>), [3d](<https://devfeed.tech/tags/3d.md>), [3d-ic](<https://devfeed.tech/tags/3d-ic.md>), [advanced-packaging](<https://devfeed.tech/tags/advanced-packaging.md>), [ai](<https://devfeed.tech/tags/ai.md>), [ai-for-eda](<https://devfeed.tech/tags/ai-for-eda.md>), [ai-ml-dl](<https://devfeed.tech/tags/ai-ml-dl.md>), [benchmark](<https://devfeed.tech/tags/benchmark.md>), [chiplets](<https://devfeed.tech/tags/chiplets.md>), [design-verification](<https://devfeed.tech/tags/design-verification.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [ic-thermbench](<https://devfeed.tech/tags/ic-thermbench.md>), [machine-learning](<https://devfeed.tech/tags/machine-learning.md>), [ood](<https://devfeed.tech/tags/ood.md>), [out-of-distribution-generalization](<https://devfeed.tech/tags/out-of-distribution-generalization.md>), [packaging](<https://devfeed.tech/tags/packaging.md>), [paper](<https://devfeed.tech/tags/paper.md>), [power-performance](<https://devfeed.tech/tags/power-performance.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [shanghaitech-university](<https://devfeed.tech/tags/shanghaitech-university.md>), [technical-papers](<https://devfeed.tech/tags/technical-papers.md>), [technical-university-of-munich](<https://devfeed.tech/tags/technical-university-of-munich.md>), [thermal-management](<https://devfeed.tech/tags/thermal-management.md>), [thermal-modeling](<https://devfeed.tech/tags/thermal-modeling.md>), [thermal-prediction](<https://devfeed.tech/tags/thermal-prediction.md>), [thermal-simulation](<https://devfeed.tech/tags/thermal-simulation.md>), [university-of-technology-sydney](<https://devfeed.tech/tags/university-of-technology-sydney.md>)

## AI overview

Researchers from the University of Technology Sydney, ShanghaiTech University, and Technical University of Munich published IC-ThermBench, an open benchmark for evaluating generalizable AI models for thermal behavior in 2.5D and 3D integrated circuits. The benchmark includes steady-state, transient, industrial package, and 2.5D chiplet tasks, including a 50,000-sample extension.

## Source excerpt

Researchers at the University of Technology Sydney, ShanghaiTech University, and Technical University of Munich published a technical paper titled "IC-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning." Abstract Excerpt: "We introduce IC-ThermBench, an open and progressive benchmark that combines established 3D-IC steady-state, transient, and industrial package tasks with a new 50,000-sample 2.5D chiplet... " read more The post Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech) appeared first on Semiconductor Engineering.