# Qualcomm and Amazon Sign Multi-Generation Deal for Custom AI Inference Silicon and 1.6T Optical Interconnects

DevFeed: [Qualcomm and Amazon Sign Multi-Generation Deal for Custom AI Inference Silicon and 1.6T Optical Interconnects](<https://devfeed.tech/articles/qualcomm-and-amazon-sign-multi-generation-deal-for-custom-ai-inference-silicon-and-1-6t-optical-interconnects-12375.md>)

Original publisher: [Read original article](<https://www.storagereview.com/news/qualcomm-and-amazon-sign-multi-generation-deal-for-custom-ai-inference-silicon-and-1-6t-optical-interconnects>)

Author: Harold Fritts

Published: 2026-09-08T17:17:46Z

Content type: news

Language: en

Sources: [StorageReview.com](<https://devfeed.tech/sources/storagereview-com.md>)

Topics: [Inference](<https://devfeed.tech/topics/inference.md>), [Inference Performance](<https://devfeed.tech/topics/inference-performance.md>), [AI Infrastructure](<https://devfeed.tech/topics/ai-infrastructure.md>), [Amazon Web Services](<https://devfeed.tech/topics/aws.md>), [data centers](<https://devfeed.tech/topics/data-centers.md>), [Chip design](<https://devfeed.tech/topics/chip-design.md>), [networking](<https://devfeed.tech/topics/networking.md>), [Amazon Bedrock](<https://devfeed.tech/topics/amazon-bedrock.md>), [amazon](<https://devfeed.tech/topics/amazon.md>)

Tags: [ai](<https://devfeed.tech/tags/ai.md>), [ai-data-centers](<https://devfeed.tech/tags/ai-data-centers.md>), [ai-inference](<https://devfeed.tech/tags/ai-inference.md>), [ai-infrastructure](<https://devfeed.tech/tags/ai-infrastructure.md>), [amazon-bedrock](<https://devfeed.tech/tags/amazon-bedrock.md>), [aws](<https://devfeed.tech/tags/aws.md>), [chip-design](<https://devfeed.tech/tags/chip-design.md>), [cost](<https://devfeed.tech/tags/cost.md>), [data-centers](<https://devfeed.tech/tags/data-centers.md>), [dsp](<https://devfeed.tech/tags/dsp.md>), [efficiency](<https://devfeed.tech/tags/efficiency.md>), [enterprise](<https://devfeed.tech/tags/enterprise.md>), [networking](<https://devfeed.tech/tags/networking.md>), [partnership](<https://devfeed.tech/tags/partnership.md>), [qualcomm](<https://devfeed.tech/tags/qualcomm.md>)

## AI overview

Qualcomm Technologies and Amazon are collaborating across multiple generations to develop custom silicon for AWS AI data centers, primarily targeting AI inference. The agreement also covers 1.6T optical connectivity for data center networks and Qualcomm's use of AWS infrastructure, including Amazon Bedrock, for electronic design automation workloads.

## Source excerpt

Qualcomm Technologies and Amazon have entered into a multi-generation collaboration to deliver customized silicon at scale for AWS's AI data centers, with AI inference as the primary target. The agreement pairs Qualcomm's power-efficient processing, silicon design, and system-level integration with Amazon's AI infrastructure, and is aimed at the compute, memory bandwidth, networking, and energy constraints The post Qualcomm and Amazon Sign Multi-Generation Deal for Custom AI Inference Silicon and 1.6T Optical Interconnects appeared first on StorageReview.com.