# Talking with Synopsys about the Physics of Chip Design at DAC 2026

DevFeed: [Talking with Synopsys about the Physics of Chip Design at DAC 2026](<https://devfeed.tech/articles/talking-with-synopsys-about-the-physics-of-chip-design-at-dac-2026-14005.md>)

Original publisher: [Read original article](<https://chipsandcheese.com/p/talking-with-synopsys-about-the-physics>)

Author: George Cozma

Published: 2026-08-11T16:52:16Z

Content type: article

Language: en

Sources: [Chips and Cheese](<https://devfeed.tech/sources/chips-and-cheese.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>), [3D](<https://devfeed.tech/topics/3d.md>), [Simulation and Design](<https://devfeed.tech/topics/simulation-and-design.md>)

Tags: [3d](<https://devfeed.tech/tags/3d.md>), [audio](<https://devfeed.tech/tags/audio.md>), [automotive](<https://devfeed.tech/tags/automotive.md>), [battery](<https://devfeed.tech/tags/battery.md>), [chip-design](<https://devfeed.tech/tags/chip-design.md>), [communications](<https://devfeed.tech/tags/communications.md>), [design](<https://devfeed.tech/tags/design.md>), [desktop](<https://devfeed.tech/tags/desktop.md>), [heat](<https://devfeed.tech/tags/heat.md>), [interview](<https://devfeed.tech/tags/interview.md>), [low-power](<https://devfeed.tech/tags/low-power.md>), [physics](<https://devfeed.tech/tags/physics.md>), [techniques](<https://devfeed.tech/tags/techniques.md>)

## AI overview

An edited audio interview with Synopsys executive Ravi Subramanian examines the physics involved in chip design and electronic design automation tools. The discussion covers larger chips, 2.5D and 3D multi-die integration, thermal management, low-power mobile systems, and automotive operating environments.

## Source excerpt

Hello you fine Internet folks,