# dielectric materials

Published articles for dielectric materials.

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## Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)

DevFeed: [Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)](<https://devfeed.tech/articles/predicting-thermal-conductivity-in-advanced-beol-interconnect-stacks-peking-university-55472.md>)

Original publisher: [Read original article](<https://semiengineering.com/predicting-thermal-conductivity-in-advanced-beol-interconnect-stacks-peking-university/>)

Author: Technical Paper Link

Published: 2026-09-19T20:05:04Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [structure](<https://devfeed.tech/topics/structure.md>), [dataset](<https://devfeed.tech/topics/dataset.md>), [3D](<https://devfeed.tech/topics/3d.md>), [domain](<https://devfeed.tech/topics/domain.md>)

Tags: [3d](<https://devfeed.tech/tags/3d.md>), [3d-ic](<https://devfeed.tech/tags/3d-ic.md>), [advanced-process-nodes](<https://devfeed.tech/tags/advanced-process-nodes.md>), [analysis](<https://devfeed.tech/tags/analysis.md>), [back-end-of-line](<https://devfeed.tech/tags/back-end-of-line.md>), [beol](<https://devfeed.tech/tags/beol.md>), [circuits](<https://devfeed.tech/tags/circuits.md>), [copper](<https://devfeed.tech/tags/copper.md>), [dielectric-materials](<https://devfeed.tech/tags/dielectric-materials.md>), [effective-medium-theory](<https://devfeed.tech/tags/effective-medium-theory.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [interconnects](<https://devfeed.tech/tags/interconnects.md>), [layer](<https://devfeed.tech/tags/layer.md>), [manufacturing](<https://devfeed.tech/tags/manufacturing.md>), [materials](<https://devfeed.tech/tags/materials.md>), [measurements](<https://devfeed.tech/tags/measurements.md>), [model](<https://devfeed.tech/tags/model.md>), [models](<https://devfeed.tech/tags/models.md>), [paper](<https://devfeed.tech/tags/paper.md>), [peking-university](<https://devfeed.tech/tags/peking-university.md>), [power-performance](<https://devfeed.tech/tags/power-performance.md>), [practical](<https://devfeed.tech/tags/practical.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [spatial](<https://devfeed.tech/tags/spatial.md>), [structure](<https://devfeed.tech/tags/structure.md>), [tdtr](<https://devfeed.tech/tags/tdtr.md>), [technical](<https://devfeed.tech/tags/technical.md>), [technical-papers](<https://devfeed.tech/tags/technical-papers.md>), [thermal-boundary-resistance](<https://devfeed.tech/tags/thermal-boundary-resistance.md>), [thermal-conductivity](<https://devfeed.tech/tags/thermal-conductivity.md>), [thermal-management](<https://devfeed.tech/tags/thermal-management.md>), [thermal-modeling](<https://devfeed.tech/tags/thermal-modeling.md>), [time-domain-thermoreflectance](<https://devfeed.tech/tags/time-domain-thermoreflectance.md>), [university](<https://devfeed.tech/tags/university.md>)

### AI overview

Researchers at Peking University developed a structure-aware framework for predicting thermal conductivity in back-end-of-line interconnect stacks. The framework uses layer-resolved time-domain thermoreflectance measurements, a dataset of more than 40 measured conductivity values, and an effective-medium model for spatial variations within practical layers and 3D integrated circuits.

### Source excerpt

Researchers at Peking University published a technical paper titled "Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements." Abstract Excerpt: "The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (κ) modeling framework. However, generalizable... " read more The post Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University) appeared first on Semiconductor Engineering.