# GAA FETs

Published articles for GAA FETs.

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## Beyond The Chip: How AI Is Reshaping Semiconductor Design And Manufacturing

DevFeed: [Beyond The Chip: How AI Is Reshaping Semiconductor Design And Manufacturing](<https://devfeed.tech/articles/beyond-the-chip-how-ai-is-reshaping-semiconductor-design-and-manufacturing-118091.md>)

Original publisher: [Read original article](<https://semiengineering.com/beyond-the-chip-how-ai-is-reshaping-semiconductor-design-and-manufacturing/>)

Author: Prashanth Aprameyan

Published: 2026-11-04T08:01:58Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>), [intel](<https://devfeed.tech/topics/intel.md>), [AI Trends](<https://devfeed.tech/topics/ai-trends.md>), [communications](<https://devfeed.tech/topics/communications.md>), [High-Performance Computing](<https://devfeed.tech/topics/high-performance-computing.md>)

Tags: [18a](<https://devfeed.tech/tags/18a.md>), [2-5d](<https://devfeed.tech/tags/2-5d.md>), [2-5d-integration](<https://devfeed.tech/tags/2-5d-integration.md>), [3d](<https://devfeed.tech/tags/3d.md>), [3d-integration](<https://devfeed.tech/tags/3d-integration.md>), [accelerators](<https://devfeed.tech/tags/accelerators.md>), [advanced](<https://devfeed.tech/tags/advanced.md>), [advanced-packaging](<https://devfeed.tech/tags/advanced-packaging.md>), [ai](<https://devfeed.tech/tags/ai.md>), [backside-power-delivery](<https://devfeed.tech/tags/backside-power-delivery.md>), [blogs-md](<https://devfeed.tech/tags/blogs-md.md>), [chip](<https://devfeed.tech/tags/chip.md>), [connectivity](<https://devfeed.tech/tags/connectivity.md>), [design](<https://devfeed.tech/tags/design.md>), [design-technology-co-optimization](<https://devfeed.tech/tags/design-technology-co-optimization.md>), [dtco](<https://devfeed.tech/tags/dtco.md>), [foundry-focus](<https://devfeed.tech/tags/foundry-focus.md>), [gaa-fets](<https://devfeed.tech/tags/gaa-fets.md>), [gate-all-around](<https://devfeed.tech/tags/gate-all-around.md>), [intel](<https://devfeed.tech/tags/intel.md>), [machine-learning](<https://devfeed.tech/tags/machine-learning.md>), [manufacturing](<https://devfeed.tech/tags/manufacturing.md>), [manufacturing-packaging-and-materials](<https://devfeed.tech/tags/manufacturing-packaging-and-materials.md>), [ml](<https://devfeed.tech/tags/ml.md>), [power-delivery](<https://devfeed.tech/tags/power-delivery.md>), [resilience](<https://devfeed.tech/tags/resilience.md>), [scaling](<https://devfeed.tech/tags/scaling.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [semiconductor-design](<https://devfeed.tech/tags/semiconductor-design.md>), [semiconductor-manufacturing](<https://devfeed.tech/tags/semiconductor-manufacturing.md>), [supply-chain](<https://devfeed.tech/tags/supply-chain.md>), [supply-chain-resilience](<https://devfeed.tech/tags/supply-chain-resilience.md>)

### AI overview

AI scaling is constrained by power delivery, connectivity, advanced packaging, and supply chain resilience as well as transistor scaling. The excerpt describes a shift from monolithic SoCs to modular chiplet systems, with UCIe for chiplet communication and packaging technologies such as EMIB-T and Foveros Direct. Intel 18A combines RibbonFET gate-all-around transistors with PowerVia backside power delivery; the source reports lower resistance and power noise, up to 10% higher cell utilization, and an 18% performance-per-watt improvement versus Intel 3, while noting added manufacturing complexity and a cost approach based on 32 nm frontside lower-metal pitches. Intel says AI and machine learning also support design tradeoff exploration, defect detection and diagnosis using factory image data, yield learning, and predictive equipment maintenance. Sovereign AI demand is linked to secure, geographically diverse manufacturing; Intel describes production capabilities across North America, Europe, and Asia.

### Source excerpt

Power delivery, connectivity, advanced packaging, and supply chain resilience are emerging as the primary constraints on AI scaling. The post Beyond The Chip: How AI Is Reshaping Semiconductor Design And Manufacturing appeared first on Semiconductor Engineering.

## Virtual Fabrication Meets Stress Physics: Solving GAA Channel Non-Uniformity

DevFeed: [Virtual Fabrication Meets Stress Physics: Solving GAA Channel Non-Uniformity](<https://devfeed.tech/articles/virtual-fabrication-meets-stress-physics-solving-gaa-channel-non-uniformity-52608.md>)

Original publisher: [Read original article](<https://semiengineering.com/virtual-fabrication-meets-stress-physics-solving-gaa-channel-non-uniformity/>)

Author: Swapnil Kailash More

Published: 2026-09-17T07:04:20Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Simulation and Design](<https://devfeed.tech/topics/simulation-and-design.md>), [Optimization](<https://devfeed.tech/topics/optimization.md>)

Tags: [blogs-md](<https://devfeed.tech/tags/blogs-md.md>), [channel-width](<https://devfeed.tech/tags/channel-width.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [etch](<https://devfeed.tech/tags/etch.md>), [gaa-fets](<https://devfeed.tech/tags/gaa-fets.md>), [gate-all-around](<https://devfeed.tech/tags/gate-all-around.md>), [lam-research](<https://devfeed.tech/tags/lam-research.md>), [manufacturing-packaging-and-materials](<https://devfeed.tech/tags/manufacturing-packaging-and-materials.md>), [mechanical-stress](<https://devfeed.tech/tags/mechanical-stress.md>), [nanosheets](<https://devfeed.tech/tags/nanosheets.md>), [perfecting-the-process](<https://devfeed.tech/tags/perfecting-the-process.md>), [physics](<https://devfeed.tech/tags/physics.md>), [process-modeling](<https://devfeed.tech/tags/process-modeling.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [semiconductor-manufacturing](<https://devfeed.tech/tags/semiconductor-manufacturing.md>), [virtual-fabrication](<https://devfeed.tech/tags/virtual-fabrication.md>)

### AI overview

The article explains how non-uniform mechanical stress across stacked nanosheet channels in gate-all-around transistors affects carrier mobility, current flow, threshold voltage, and leakage. It describes using SEMulator3D stress modeling to identify process variations and optimize channel thickness, fin width, and lateral etch, including a finding that a slightly thicker top channel improves stress uniformity.

### Source excerpt

Even small imbalances between stacked nanosheets can distort device behavior in ways that are difficult to predict from geometry alone. The post Virtual Fabrication Meets Stress Physics: Solving GAA Channel Non-Uniformity appeared first on Semiconductor Engineering.