# Ibiden

Published articles for Ibiden.

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## Chip Industry Week In Review

DevFeed: [Chip Industry Week In Review](<https://devfeed.tech/articles/chip-industry-week-in-review-97362.md>)

Original publisher: [Read original article](<https://semiengineering.com/chip-industry-week-in-review-161/>)

Author: The SE Staff

Published: 2026-10-23T07:01:23Z

Content type: news

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>), [intel](<https://devfeed.tech/topics/intel.md>), [tsmc](<https://devfeed.tech/topics/tsmc.md>)

Tags: [800v](<https://devfeed.tech/tags/800v.md>), [accellera](<https://devfeed.tech/tags/accellera.md>), [advanced-photonics-coalition](<https://devfeed.tech/tags/advanced-photonics-coalition.md>), [ai](<https://devfeed.tech/tags/ai.md>), [ai-data](<https://devfeed.tech/tags/ai-data.md>), [ai-data-centers](<https://devfeed.tech/tags/ai-data-centers.md>), [alibaba](<https://devfeed.tech/tags/alibaba.md>), [alice-bob](<https://devfeed.tech/tags/alice-bob.md>), [altera](<https://devfeed.tech/tags/altera.md>), [amd](<https://devfeed.tech/tags/amd.md>), [amkor-technology](<https://devfeed.tech/tags/amkor-technology.md>), [ap-memory](<https://devfeed.tech/tags/ap-memory.md>), [arteris](<https://devfeed.tech/tags/arteris.md>), [asml](<https://devfeed.tech/tags/asml.md>), [atomera](<https://devfeed.tech/tags/atomera.md>), [axcelis](<https://devfeed.tech/tags/axcelis.md>), [be-semiconductor-industries](<https://devfeed.tech/tags/be-semiconductor-industries.md>), [business](<https://devfeed.tech/tags/business.md>), [business-news](<https://devfeed.tech/tags/business-news.md>), [bytedance](<https://devfeed.tech/tags/bytedance.md>), [cadence](<https://devfeed.tech/tags/cadence.md>), [capacity](<https://devfeed.tech/tags/capacity.md>), [china](<https://devfeed.tech/tags/china.md>), [chip](<https://devfeed.tech/tags/chip.md>), [chipagents](<https://devfeed.tech/tags/chipagents.md>), [chips](<https://devfeed.tech/tags/chips.md>), [chips-act-funding](<https://devfeed.tech/tags/chips-act-funding.md>), [commonwealth-fusion-systems](<https://devfeed.tech/tags/commonwealth-fusion-systems.md>), [data](<https://devfeed.tech/tags/data.md>), [data-centers](<https://devfeed.tech/tags/data-centers.md>), [dgist](<https://devfeed.tech/tags/dgist.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [esd-alliance](<https://devfeed.tech/tags/esd-alliance.md>), [everspin-technologies](<https://devfeed.tech/tags/everspin-technologies.md>), [first](<https://devfeed.tech/tags/first.md>), [gan](<https://devfeed.tech/tags/gan.md>), [gpus](<https://devfeed.tech/tags/gpus.md>), [helion](<https://devfeed.tech/tags/helion.md>), [hoover-institution](<https://devfeed.tech/tags/hoover-institution.md>), [ibiden](<https://devfeed.tech/tags/ibiden.md>), [imec](<https://devfeed.tech/tags/imec.md>), [indium](<https://devfeed.tech/tags/indium.md>), [industry](<https://devfeed.tech/tags/industry.md>), [infineon](<https://devfeed.tech/tags/infineon.md>), [institute-for-ai-policy-and-strategy](<https://devfeed.tech/tags/institute-for-ai-policy-and-strategy.md>), [institute-for-basic-science](<https://devfeed.tech/tags/institute-for-basic-science.md>), [intel](<https://devfeed.tech/tags/intel.md>), [iqe](<https://devfeed.tech/tags/iqe.md>), [materials](<https://devfeed.tech/tags/materials.md>), [memory](<https://devfeed.tech/tags/memory.md>), [news](<https://devfeed.tech/tags/news.md>), [review](<https://devfeed.tech/tags/review.md>), [week-in-review](<https://devfeed.tech/tags/week-in-review.md>)

### AI overview

The roundup reports a broad push to expand chip capacity and adapt systems for AI. The U.S. Commerce Department signed letters of intent for up to $389 million in semiconductor R&D awards to four companies working on power devices and critical materials; proposed terms include minority, nonvoting government equity stakes. Amkor plans to expand South Korean packaging capacity, while UMC and AP Memory are developing silicon-capacitor power delivery that moves capacitance into advanced packages. Infineon and Nvidia are advancing 800 VDC data-center power architectures using GaN intermediate bus converters. Micron targets vertical HBM volume production in 2028 and plans 1δ DRAM and 400-plus-layer G11 NAND ramps in the second half of 2027. Other developments include Intel's Arizona fab construction, reported upgrades at Samsung and SK hynix China NAND fabs, and reported Chinese orders exceeding $35 billion for Nvidia RTX PRO 5500 GPUs. Research highlights include antiferromagnetic memory switching and integrated 2D transistors. The roundup also covers security vulnerabilities and incidents, including Siemens Software Center exploitation and exposed third-party API keys in an OpenCode-re

### Source excerpt

CHIPS Act $389M to power chips, vertical GaN, materials; Micron's memory roadmap; Nvidia expands supply chain capacity; Tenstorrent raises $1.5B; China NAND fabs; 800V power for AI data centers; Intel advances Arizona fab; China orders +$35B in Nvidia GPUs. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.