# mixed signal Published articles for mixed signal. This is one page of public article previews, not the complete archive. Follow Next page to continue. Summaries are not the original full articles. ## AI Demand Will Keep DRAM Market Under Pressure DevFeed: [AI Demand Will Keep DRAM Market Under Pressure]() Original publisher: [Read original article]() Author: Gary Hilson Published: 2026-09-18T12:00:00Z Content type: news Language: en Sources: [EE Times]() Topics: [Artificial Intelligence](), [AI Infrastructure](), [Computing](), [datacenter]() Tags: [ai](), [ai-and-big-data](), [ai-infrastructure](), [analog](), [analysis](), [business](), [community](), [computing](), [data-center](), [designline](), [digital](), [dram](), [education](), [ee-times](), [ee-times-university](), [eelife](), [eelive-electronic-design](), [eet](), [electrical-engineering](), [electronic-components](), [electronic-engineering-times](), [electronics](), [embedded-systems](), [fundamentals-courses](), [high-bandwidth-memory](), [industry](), [infrastructure](), [learning](), [memory](), [mixed-signal](), [news](), [opinion](), [part-search](), [product-search](), [semiconductors](), [software](), [tech-papers](), [technology](), [video]() ### AI overview AI infrastructure spending is driving sustained DRAM shortages, with analysts expecting supply constraints to continue through 2027 or longer. The article explains how data center demand, limited manufacturing capacity, long-term supply agreements, and cautious expansion are shaping the memory market. ### Source excerpt AI infrastructure spending is driving DRAM shortages that will continue through 2027, pushing consumer electronics makers further down priority lists. The post AI Demand Will Keep DRAM Market Under Pressure appeared first on EE Times. ## Piecing Together the Indian Electronics and Semiconductor Ecosystem DevFeed: [Piecing Together the Indian Electronics and Semiconductor Ecosystem]() Original publisher: [Read original article]() Author: Yashasvini Razdan Published: 2026-09-18T08:00:00Z Content type: article Language: en Sources: [EE Times]() Topics: [Computing](), [Chip design](), [Quantum Computing](), [ibm](), [Artificial Intelligence]() Tags: [advanced-packaging](), [ai](), [analog](), [analysis](), [business](), [chip](), [community](), [computing](), [designline](), [digital](), [education](), [ee-times](), [ee-times-university](), [eelife](), [eelive-electronic-design](), [eet](), [electrical-engineering](), [electronic-components](), [electronic-engineering-times](), [electronics](), [embedded-systems](), [fundamentals-courses](), [ibm](), [india](), [learning](), [mixed-signal](), [neuromorphic](), [news](), [opinion](), [part-search](), [product-search](), [quantum-computing](), [semiconductor](), [semiconductors](), [software](), [supply-chain](), [tech-papers](), [technology](), [video]() ### AI overview This special report examines how India's electronics and semiconductor ecosystem is developing through semiconductor packaging facilities, government investment, deep-tech startups, domestic materials and equipment efforts, IBM quantum computing plans, and neuromorphic chip research. ### Source excerpt India Semiconductor Mission 2.0, quantum computing with IBM, neuromorphic chips, and deep-tech startups: six stories on how India's chip ecosystem is taking shape. The post Piecing Together the Indian Electronics and Semiconductor Ecosystem appeared first on EE Times. ## U.S. Awards Anderon $1B for Quantum Wafer Manufacturing DevFeed: [U.S. Awards Anderon $1B for Quantum Wafer Manufacturing]() Original publisher: [Read original article]() Author: Alan Patterson Published: 2026-09-17T22:00:00Z Content type: news Language: en Sources: [EE Times]() Topics: [Quantum Computing](), [ibm](), [Computing]() Tags: [analog](), [analysis](), [business](), [chip](), [chip-manufacturing](), [chips-and-science-act](), [community](), [computing](), [designline](), [digital](), [education](), [ee-times](), [ee-times-university](), [eelife](), [eelive-electronic-design](), [eet](), [electrical-engineering](), [electronic-components](), [electronic-engineering-times](), [electronics](), [embedded-systems](), [fundamentals-courses](), [ibm](), [investment](), [learning](), [manufacturing](), [mixed-signal](), [news](), [opinion](), [part-search](), [product-search](), [quantum](), [quantum-computing](), [semiconductors](), [software](), [tech-papers](), [technology](), [video](), [wafer-manufacturing]() ### AI overview The U.S. Department of Commerce awarded IBM's quantum chip foundry, Anderon, $1 billion under the CHIPS Act to accelerate domestic production of 300-mm quantum wafers. The article examines the shift toward production-scale quantum computing and the specialized manufacturing processes, materials, packaging, metrology, and yield optimization that quantum devices can require. ### Source excerpt Washington bets $1B on IBM's Anderon to forge quantum wafers on U.S. soil as the race leaves labs behind. The post U.S. Awards Anderon $1B for Quantum Wafer Manufacturing appeared first on EE Times. ## SK Hynix's Intel Liaisons: What You Need to Know DevFeed: [SK Hynix's Intel Liaisons: What You Need to Know]() Original publisher: [Read original article]() Author: Majeed Ahmad Published: 2026-09-17T11:30:00Z Content type: news Language: en Sources: [EE Times]() Topics: [intel]() Tags: [analog](), [analysis](), [asia-watch](), [business](), [chip-manufacturing](), [community](), [designline](), [digital](), [education](), [ee-times](), [ee-times-university](), [eelife](), [eelive-electronic-design](), [eet](), [electrical-engineering](), [electronic-components](), [electronic-engineering-times](), [electronics](), [embedded-systems](), [fundamentals-courses](), [geopolitics](), [intel](), [learning](), [manufacturing](), [memory-chips](), [mixed-signal](), [news](), [opinion](), [part-search](), [politics](), [product-search](), [semiconductor](), [semiconductors](), [software](), [south-korea](), [tech-papers](), [technology](), [video]() ### AI overview The article examines possible arrangements between SK Hynix and Intel involving Intel's delayed Ohio chipmaking facilities. It reports that leasing, a joint venture, and other deal structures are being explored, while emphasizing that talks remain speculative and may be influenced by U.S. trade and manufacturing policy. ### Source excerpt The deal between Intel and SK Hynix seems imminent not because of technology business imperatives, but because of geopolitical factors. The post SK Hynix's Intel Liaisons: What You Need to Know appeared first on EE Times. ## No Summer Lull for Semiconductors DevFeed: [No Summer Lull for Semiconductors]() Original publisher: [Read original article]() Author: Anne-Françoise Pelé Published: 2026-09-17T08:03:34Z Content type: news Language: en Sources: [EE Times]() Topics: [Artificial Intelligence](), [intel](), [Inference Performance](), [datacenter](), [Nvidia](), [tsmc](), [groq](), [hugging face](), [samsung]() Tags: [ai](), [ai-inference](), [analog](), [analysis](), [blog](), [business](), [capital-investment](), [community](), [designline](), [digital](), [education](), [ee-times](), [ee-times-university](), [eelife](), [eelive-electronic-design](), [eet](), [electrical-engineering](), [electronic-components](), [electronic-engineering-times](), [electronics](), [embedded-systems](), [fundamentals-courses](), [groq](), [hugging-face](), [infrastructure](), [intel](), [ipo](), [joint-venture](), [learning](), [mergers-acquisitions](), [mixed-signal](), [news](), [nvidia](), [opinion](), [part-search](), [product-search](), [samsung](), [semiconductor](), [semiconductors](), [software](), [tech-papers](), [technology](), [venture-capital-funding](), [video]() ### AI overview A news report describes sustained semiconductor-industry activity, including acquisitions, investments, joint ventures, and fundraising. It highlights AI-driven demand for memory, advanced packaging, manufacturing equipment, foundry capacity, data-center infrastructure, inference, and edge chips. ### Source excerpt There was a time when summer slowed the semiconductor news cycle. Not this year. The post No Summer Lull for Semiconductors appeared first on EE Times. ## Smarter Cameras Need More Than Edge AI to Protect Privacy DevFeed: [Smarter Cameras Need More Than Edge AI to Protect Privacy]() Original publisher: [Read original article]() Author: Pat Brans Published: 2026-09-16T18:00:00Z Content type: news Language: en Sources: [EE Times]() Topics: [Artificial Intelligence](), [Hardware](), [Deep learning](), [processing](), [real-time](), [Security]() Tags: [ai](), [analog](), [analysis](), [business](), [cameras](), [community](), [data-anonymization](), [data-privacy](), [data-processing](), [deep-learning](), [designline](), [digital](), [edge-ai](), [education](), [ee-times](), [ee-times-university](), [eelife](), [eelive-electronic-design](), [eet](), [electrical-engineering](), [electronic-components](), [electronic-engineering-times](), [electronics](), [embedded-systems](), [encryption](), [fundamentals-courses](), [hardware](), [learning](), [mixed-signal](), [news](), [opinion](), [part-search](), [privacy](), [processing](), [product-search](), [real-time](), [security-systems](), [semiconductors](), [software](), [tech-papers](), [technology](), [video]() ### AI overview Intelligent cameras can analyze video locally to detect hazards, count occupants, track packages, and support manufacturing workflows while masking people, faces, or license plates when identity is unnecessary. Axis Communications uses deep-learning processing in its ARTPEC system-on-chip, reducing the need to send continuous video to the cloud. ### Source excerpt Axis Communications and Pimloc show how masking, encryption, anonymization, and governance can protect privacy without destroying useful evidence. The post Smarter Cameras Need More Than Edge AI to Protect Privacy appeared first on EE Times.