# NAND

Published articles for NAND.

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## Micron's Next NAND Is G11, Not G10: 400-Plus Layers, 2x Density, and a 512TB SSD Ceiling on a 2H 2027 Ramp

DevFeed: [Micron's Next NAND Is G11, Not G10: 400-Plus Layers, 2x Density, and a 512TB SSD Ceiling on a 2H 2027 Ramp](<https://devfeed.tech/articles/micron-s-next-nand-is-g11-not-g10-400-plus-layers-2x-density-and-a-512tb-ssd-ceiling-on-a-2h-2027-ramp-102667.md>)

Original publisher: [Read original article](<https://www.storagereview.com/news/micron-g11-nand-400-layers-2x-density-512tb-ssd-2h-2027>)

Author: Brian Beeler

Published: 2026-10-27T17:43:20Z

Content type: news

Language: en

Sources: [StorageReview.com](<https://devfeed.tech/sources/storagereview-com.md>)

Topics: [memory price increases](<https://devfeed.tech/topics/memory-price-increases.md>), [AI Infrastructure](<https://devfeed.tech/topics/ai-infrastructure.md>)

Tags: [1-delta-dram](<https://devfeed.tech/tags/1-delta-dram.md>), [company](<https://devfeed.tech/tags/company.md>), [enterprise](<https://devfeed.tech/tags/enterprise.md>), [first](<https://devfeed.tech/tags/first.md>), [flash](<https://devfeed.tech/tags/flash.md>), [layers](<https://devfeed.tech/tags/layers.md>), [micron](<https://devfeed.tech/tags/micron.md>), [nand](<https://devfeed.tech/tags/nand.md>), [next](<https://devfeed.tech/tags/next.md>), [node](<https://devfeed.tech/tags/node.md>), [number](<https://devfeed.tech/tags/number.md>), [october](<https://devfeed.tech/tags/october.md>), [plus](<https://devfeed.tech/tags/plus.md>), [products](<https://devfeed.tech/tags/products.md>), [ramp](<https://devfeed.tech/tags/ramp.md>), [ssd](<https://devfeed.tech/tags/ssd.md>), [ssds](<https://devfeed.tech/tags/ssds.md>), [statement](<https://devfeed.tech/tags/statement.md>), [technology](<https://devfeed.tech/tags/technology.md>), [webinar](<https://devfeed.tech/tags/webinar.md>), [with](<https://devfeed.tech/tags/with.md>)

### AI overview

Micron's G11 NAND, skipping G10, is planned for volume ramp in the second half of 2027. Micron says it will use wafer-on-wafer bonding, exceed 400 layers, roughly double G9 bit density per wafer area, raise I/O speed by up to 1.5x, and reduce data-transfer energy per bit by more than 25%. The article interprets bonding as separating array and logic wafer processing to ease constraints on taller stacks; Micron did not explain the mechanism. Its deck lists future data center SSDs up to 512TB, but gives no product, date, interface, or cell type, so this remains a roadmap figure. Micron also describes two AI-class NAND concepts: small-block, SLC-based high-IOPS storage targeting 25-100 million IOPS, and TSV-stacked high-bandwidth flash on a logic base die, positioned near compute rather than beside the GPU's HBM. The latter is costlier and would require customer partnership; neither design has a named product, bandwidth figure, or customer. The ramp comes amid Micron's stated expectation of tighter memory and storage supply through 2027-28.

### Source excerpt

Micron's next NAND node is G11, with no G10 between it and the G9 flash in its SSDs today. The density chart in the deck for Micron's October 21 technology webinar runs G7, G8, G9, G11, and Scott DeBoer, the company's president and chief technology and products officer, framed the skipped number as a statement The post Micron's Next NAND Is G11, Not G10: 400-Plus Layers, 2x Density, and a 512TB SSD Ceiling on a 2H 2027 Ramp appeared first on StorageReview.com.

## Micron's 2027 roadmap: DDR6 with 2x DDR5 bandwidth, 1TB RDIMMs, and 400+ layer NAND

DevFeed: [Micron's 2027 roadmap: DDR6 with 2x DDR5 bandwidth, 1TB RDIMMs, and 400+ layer NAND](<https://devfeed.tech/articles/micron-s-2027-roadmap-ddr6-with-2x-ddr5-bandwidth-1tb-rdimms-and-400-layer-nand-98388.md>)

Original publisher: [Read original article](<https://www.techspot.com/news/114313-micron-2027-roadmap-ddr6-2x-ddr5-bandwidth-1tb.html>)

Author: Kishalaya Kundu

Published: 2026-10-23T20:12:00Z

Content type: news

Language: en

Sources: [TechSpot](<https://devfeed.tech/sources/techspot.md>)

Topics: [roadmaps](<https://devfeed.tech/topics/roadmaps.md>), [AI Infrastructure](<https://devfeed.tech/topics/ai-infrastructure.md>), [ddr5](<https://devfeed.tech/topics/ddr5.md>), [memory price increases](<https://devfeed.tech/topics/memory-price-increases.md>)

Tags: [advanced](<https://devfeed.tech/tags/advanced.md>), [ai](<https://devfeed.tech/tags/ai.md>), [ai-data-centers](<https://devfeed.tech/tags/ai-data-centers.md>), [ai-infrastructure-spending](<https://devfeed.tech/tags/ai-infrastructure-spending.md>), [ai-workloads](<https://devfeed.tech/tags/ai-workloads.md>), [bandwidth](<https://devfeed.tech/tags/bandwidth.md>), [cmos](<https://devfeed.tech/tags/cmos.md>), [complexity](<https://devfeed.tech/tags/complexity.md>), [control](<https://devfeed.tech/tags/control.md>), [ddr](<https://devfeed.tech/tags/ddr.md>), [ddr5](<https://devfeed.tech/tags/ddr5.md>), [delta](<https://devfeed.tech/tags/delta.md>), [dram](<https://devfeed.tech/tags/dram.md>), [hardware](<https://devfeed.tech/tags/hardware.md>), [hbm](<https://devfeed.tech/tags/hbm.md>), [industry](<https://devfeed.tech/tags/industry.md>), [layer](<https://devfeed.tech/tags/layer.md>), [lpddr](<https://devfeed.tech/tags/lpddr.md>), [manufacturing](<https://devfeed.tech/tags/manufacturing.md>), [memory](<https://devfeed.tech/tags/memory.md>), [micron](<https://devfeed.tech/tags/micron.md>), [nand](<https://devfeed.tech/tags/nand.md>), [node](<https://devfeed.tech/tags/node.md>), [products](<https://devfeed.tech/tags/products.md>), [roadmap](<https://devfeed.tech/tags/roadmap.md>), [storage](<https://devfeed.tech/tags/storage.md>), [structure](<https://devfeed.tech/tags/structure.md>)

### AI overview

Micron's roadmap targets higher-capacity, higher-bandwidth memory for AI infrastructure, with volume production of its 1-Delta DRAM node and G11 NAND planned for H2 2027. Micron says 1-Delta will raise DRAM bit density by about 25% over 1-Gamma and support DDR6 and LPDDR6. DDR6 is positioned for high-reliability AI servers, with over twice DDR5's bandwidth; no official launch date is given. LPDDR6 is claimed to improve power efficiency by 35% over LPDDR5. Micron also plans 1TB RDIMMs and a vertically stacked vHBM design intended to increase bandwidth per watt. For NAND, G11's targets versus G9 are twice the bit density, 1.5 times the I/O speed, and over 25% lower energy per data transfer. These are roadmap claims and targets, not reported shipping products.

### Source excerpt

Micron has detailed its 1δ (1-Delta) node as the follow-up to 1γ (1-Gamma). The new node, which features angstrom-level process control and HKMG CMOS structure, will reportedly deliver roughly 25% higher bit density than its predecessor when manufacturing advanced DRAM products. Read Entire Article

## SK hynix reportedly offers to build a NAND fab in the US if Washington lets it expand in China

DevFeed: [SK hynix reportedly offers to build a NAND fab in the US if Washington lets it expand in China](<https://devfeed.tech/articles/sk-hynix-reportedly-offers-to-build-a-nand-fab-in-the-us-if-washington-lets-it-expand-in-china-88615.md>)

Original publisher: [Read original article](<https://www.techspot.com/news/114224-sk-hynix-reportedly-offers-build-nand-fab-us.html>)

Author: Skye Jacobs

Published: 2026-10-16T11:58:00Z

Content type: news

Language: en

Sources: [TechSpot](<https://devfeed.tech/sources/techspot.md>)

Topics: [DRAM price increase](<https://devfeed.tech/topics/dram-price-increase.md>), [nand flash price increase](<https://devfeed.tech/topics/nand-flash-price-increase.md>), [networking hardware prices](<https://devfeed.tech/topics/networking-hardware-prices.md>)

Tags: [applied-materials](<https://devfeed.tech/tags/applied-materials.md>), [china](<https://devfeed.tech/tags/china.md>), [computex-2026](<https://devfeed.tech/tags/computex-2026.md>), [data-center](<https://devfeed.tech/tags/data-center.md>), [data-centers](<https://devfeed.tech/tags/data-centers.md>), [exports](<https://devfeed.tech/tags/exports.md>), [factory](<https://devfeed.tech/tags/factory.md>), [flash](<https://devfeed.tech/tags/flash.md>), [flash-memory](<https://devfeed.tech/tags/flash-memory.md>), [hardware](<https://devfeed.tech/tags/hardware.md>), [industry](<https://devfeed.tech/tags/industry.md>), [lam-research](<https://devfeed.tech/tags/lam-research.md>), [let](<https://devfeed.tech/tags/let.md>), [manufacturing](<https://devfeed.tech/tags/manufacturing.md>), [manufacturing-technology](<https://devfeed.tech/tags/manufacturing-technology.md>), [nand](<https://devfeed.tech/tags/nand.md>), [politics](<https://devfeed.tech/tags/politics.md>), [sk-hynix](<https://devfeed.tech/tags/sk-hynix.md>), [united-states](<https://devfeed.tech/tags/united-states.md>), [us](<https://devfeed.tech/tags/us.md>)

### AI overview

SK hynix is reportedly proposing a US NAND fab in exchange for US approval to send more chipmaking equipment to its Dalian plant in China. Solidigm says it has buyers for all the SSDs it produces, and added tools in unused factory space could increase output. The equipment requests remain unapproved, while the US fab is still a proposal.

### Source excerpt

The equipment would go into unused space in Dalian's Mod B building. Completed in 2023, the building was never fully equipped because of the memory market downturn. Some tools are installed, but much of the space remains available. Read Entire Article

## ScaleFlux bets smarter SSD controllers can break the AI memory bottleneck

DevFeed: [ScaleFlux bets smarter SSD controllers can break the AI memory bottleneck](<https://devfeed.tech/articles/scaleflux-bets-smarter-ssd-controllers-can-break-the-ai-memory-bottleneck-86751.md>)

Original publisher: [Read original article](<https://siliconangle.com/2026/10/14/ai-factories-stall-gpus-wait-memory-storage-data-aidatapipelineforum/>)

Author: Jonathan Anthony

Published: 2026-10-14T11:15:02Z

Content type: news

Language: en

Sources: [SiliconANGLE](<https://devfeed.tech/sources/siliconangle.md>)

Topics: [AI Infrastructure](<https://devfeed.tech/topics/ai-infrastructure.md>), [M.2 NVMe](<https://devfeed.tech/topics/m-2-nvme.md>), [DRAM price increase](<https://devfeed.tech/topics/dram-price-increase.md>)

Tags: [ai](<https://devfeed.tech/tags/ai.md>), [ai-data-pipeline-forum-2026](<https://devfeed.tech/tags/ai-data-pipeline-forum-2026.md>), [ai-factories](<https://devfeed.tech/tags/ai-factories.md>), [ai-inference](<https://devfeed.tech/tags/ai-inference.md>), [ai-infrastructure](<https://devfeed.tech/tags/ai-infrastructure.md>), [ai-networking](<https://devfeed.tech/tags/ai-networking.md>), [aidatapipelineforum](<https://devfeed.tech/tags/aidatapipelineforum.md>), [chiplets](<https://devfeed.tech/tags/chiplets.md>), [compute](<https://devfeed.tech/tags/compute.md>), [cube-event-coverage](<https://devfeed.tech/tags/cube-event-coverage.md>), [cxl](<https://devfeed.tech/tags/cxl.md>), [data-centers](<https://devfeed.tech/tags/data-centers.md>), [data-movement](<https://devfeed.tech/tags/data-movement.md>), [dell](<https://devfeed.tech/tags/dell.md>), [flash](<https://devfeed.tech/tags/flash.md>), [hyperscale-computing](<https://devfeed.tech/tags/hyperscale-computing.md>), [john-furrier](<https://devfeed.tech/tags/john-furrier.md>), [liquid-cooling](<https://devfeed.tech/tags/liquid-cooling.md>), [nand](<https://devfeed.tech/tags/nand.md>), [news](<https://devfeed.tech/tags/news.md>), [open-compute-project](<https://devfeed.tech/tags/open-compute-project.md>), [open-hardware](<https://devfeed.tech/tags/open-hardware.md>), [open-standards](<https://devfeed.tech/tags/open-standards.md>), [pichai-balaji](<https://devfeed.tech/tags/pichai-balaji.md>), [power-management](<https://devfeed.tech/tags/power-management.md>), [scaleflux](<https://devfeed.tech/tags/scaleflux.md>), [ssd](<https://devfeed.tech/tags/ssd.md>), [thecube](<https://devfeed.tech/tags/thecube.md>)

### AI overview

The article reports on ScaleFlux's approach to reducing data bottlenecks in AI infrastructure with SSD and CXL memory controllers. It describes using NAND flash as active memory for AI workloads, including key-value cache offload, and cites the company's claims about flexible data placement and drive endurance.

### Source excerpt

AI factories run on graphics processing units that cost a fortune and work at blistering speed, yet those chips increasingly sit idle waiting for data. As the bottleneck moves from compute to memory and storage, NAND flash is being asked to do far more than hold files. That shift is putting data movement constraints at [...] The post ScaleFlux bets smarter SSD controllers can break the AI memory bottleneck appeared first on SiliconANGLE.

## Kioxia LD4 E1.L QLC NVMe SSD Announced

DevFeed: [Kioxia LD4 E1.L QLC NVMe SSD Announced](<https://devfeed.tech/articles/kioxia-ld4-e1-l-qlc-nvme-ssd-announced-77358.md>)

Original publisher: [Read original article](<https://www.servethehome.com/kioxia-ld4-e1-l-qlc-nvme-ssd-announced/>)

Author: Vic A

Published: 2026-10-08T13:00:12Z

Content type: news

Language: en

Sources: [ServeTheHome](<https://devfeed.tech/sources/servethehome.md>)

Topics: [M.2 NVMe](<https://devfeed.tech/topics/m-2-nvme.md>), [NVMe](<https://devfeed.tech/topics/nvme.md>), [clean energy data centers](<https://devfeed.tech/topics/clean-energy-data-centers.md>)

Tags: [bics](<https://devfeed.tech/tags/bics.md>), [data-centers](<https://devfeed.tech/tags/data-centers.md>), [e1-l](<https://devfeed.tech/tags/e1-l.md>), [edsff](<https://devfeed.tech/tags/edsff.md>), [flash-memory](<https://devfeed.tech/tags/flash-memory.md>), [hyperscale](<https://devfeed.tech/tags/hyperscale.md>), [kioxia](<https://devfeed.tech/tags/kioxia.md>), [nand](<https://devfeed.tech/tags/nand.md>), [nvme](<https://devfeed.tech/tags/nvme.md>), [nvme-ssd](<https://devfeed.tech/tags/nvme-ssd.md>), [pcie-gen5](<https://devfeed.tech/tags/pcie-gen5.md>), [servers](<https://devfeed.tech/tags/servers.md>), [ssd](<https://devfeed.tech/tags/ssd.md>), [storage](<https://devfeed.tech/tags/storage.md>)

### AI overview

Kioxia's LD4 series is an E1.L QLC NVMe SSD for read-intensive hyperscale workloads in high-density 1U servers. It uses PCIe Gen5 and launches in 15.36TB and 30.72TB models; Kioxia says its architecture has been validated for capacities up to 122.88TB.

### Source excerpt

The Kioxia LD4 is a higher-capacity E1.L NVMe SSD designed to cram a lot of sorage while taking a minimal amount of faceplate area The post Kioxia LD4 E1.L QLC NVMe SSD Announced appeared first on ServeTheHome.

## This is BiCS NAND Close Up from Kioxia and Sandisk

DevFeed: [This is BiCS NAND Close Up from Kioxia and Sandisk](<https://devfeed.tech/articles/this-is-bics-nand-close-up-from-kioxia-and-sandisk-64124.md>)

Original publisher: [Read original article](<https://www.servethehome.com/this-is-bics-nand-close-up-from-kioxia-and-sandisk/>)

Author: Eric Smith

Published: 2026-10-02T19:55:22Z

Content type: article

Language: en

Sources: [ServeTheHome](<https://devfeed.tech/sources/servethehome.md>)

Topics: [memory price increases](<https://devfeed.tech/topics/memory-price-increases.md>), [nand flash price increase](<https://devfeed.tech/topics/nand-flash-price-increase.md>)

Tags: [bics](<https://devfeed.tech/tags/bics.md>), [kioxia](<https://devfeed.tech/tags/kioxia.md>), [nand](<https://devfeed.tech/tags/nand.md>), [sandisk](<https://devfeed.tech/tags/sandisk.md>), [storage](<https://devfeed.tech/tags/storage.md>)

### AI overview

The article shows microscopic views of Kioxia and SanDisk BiCS NAND packages and wafers, including the layered structures and tiny wires. It notes that rising AI demand is increasing demand for NAND and describes the engineering challenge of fitting higher capacity and speed into NAND packages used in SSDs and other devices.

### Source excerpt

We saw BiCS NAND under the microscope at FMS 2026, and thought our readers might like to see close-ups of the packages The post This is BiCS NAND Close Up from Kioxia and Sandisk appeared first on ServeTheHome.

## Memory squeeze set to tighten through 2028, Micron says

DevFeed: [Memory squeeze set to tighten through 2028, Micron says](<https://devfeed.tech/articles/memory-squeeze-set-to-tighten-through-2028-micron-says-63205.md>)

Original publisher: [Read original article](<https://www.computerworld.com/article/4229635/memory-squeeze-set-to-tighten-through-2028-micron-says-3.html>)

Author: Gyana Swain

Published: 2026-10-01T14:06:48Z

Content type: news

Language: en

Sources: [Computerworld](<https://devfeed.tech/sources/computerworld.md>)

Topics: [memory price increases](<https://devfeed.tech/topics/memory-price-increases.md>), [DRAM price increase](<https://devfeed.tech/topics/dram-price-increase.md>), [nand flash price increase](<https://devfeed.tech/topics/nand-flash-price-increase.md>), [it modernization](<https://devfeed.tech/topics/it-modernization.md>), [Memory Leaks](<https://devfeed.tech/topics/memory-leaks.md>)

Tags: [advice](<https://devfeed.tech/tags/advice.md>), [ai](<https://devfeed.tech/tags/ai.md>), [ai-models](<https://devfeed.tech/tags/ai-models.md>), [analysts](<https://devfeed.tech/tags/analysts.md>), [budgeting](<https://devfeed.tech/tags/budgeting.md>), [budgeting-computer-components-computers-computers-and-peripherals-desktop-pcs-it-management-la](<https://devfeed.tech/tags/budgeting-computer-components-computers-computers-and-peripherals-desktop-pcs-it-management-la.md>), [computer-components](<https://devfeed.tech/tags/computer-components.md>), [computers](<https://devfeed.tech/tags/computers.md>), [computers-and-peripherals](<https://devfeed.tech/tags/computers-and-peripherals.md>), [desktop-pcs](<https://devfeed.tech/tags/desktop-pcs.md>), [dram](<https://devfeed.tech/tags/dram.md>), [flash](<https://devfeed.tech/tags/flash.md>), [idc](<https://devfeed.tech/tags/idc.md>), [it-management](<https://devfeed.tech/tags/it-management.md>), [laptops](<https://devfeed.tech/tags/laptops.md>), [memory](<https://devfeed.tech/tags/memory.md>), [memory-shortage](<https://devfeed.tech/tags/memory-shortage.md>), [micron](<https://devfeed.tech/tags/micron.md>), [micron-technology](<https://devfeed.tech/tags/micron-technology.md>), [nand](<https://devfeed.tech/tags/nand.md>), [nand-flash](<https://devfeed.tech/tags/nand-flash.md>), [research](<https://devfeed.tech/tags/research.md>), [sanjay-mehrotra](<https://devfeed.tech/tags/sanjay-mehrotra.md>), [server](<https://devfeed.tech/tags/server.md>), [servers](<https://devfeed.tech/tags/servers.md>), [shortage](<https://devfeed.tech/tags/shortage.md>), [storage](<https://devfeed.tech/tags/storage.md>), [system-memory-ram](<https://devfeed.tech/tags/system-memory-ram.md>), [technology](<https://devfeed.tech/tags/technology.md>)

### AI overview

Micron expects memory and storage supply to remain tighter in 2027 and 2028 than in 2026, with no clear date for a return to balance. The article describes rising DRAM and NAND prices, reduced memory configurations in some servers, and advice for organizations to manage equipment refreshes and memory use.

### Source excerpt

The global memory shortage that has driven up the cost of servers, storage and PCs through 2026 will get worse in 2027 and 2028, according to memory maker Micron Technology. "We expect memory and storage supply-demand conditions to be much tighter in calendar 2027 and 2028 than they were in 2026," CEO Sanjay Mehrotra said in prepared remarks for the company's fiscal fourth-quarter earnings call. Even with new cleanroom space planned across the industry, "We do not have line of sight to when supply and demand will return to balance," he said. Earlier industry forecasts had expected the two to return to balance in 2028. Mehrotra added that new plants would not bring quick relief. "Production from new DRAM and NAND fabrication facilities takes time to ramp and gradually becomes more meaningful starting a few quarters after initial output," he said. Neil Shah, vice president of research at Counterpoint Research, said the outlook means CIOs "will have to be prudent about which equipment to upgrade and which to stretch to maintain cost efficiencies." Higher prices, less memory On the same call, CFO Mark Murphy said Micron's "inventory levels and supply remain extremely tight." Its DRAM prices rose by a percentage in the high teens in the fiscal fourth quarter, while NAND prices climbed about 30%, he said. Taiwan-based market research firm TrendForce expects prices across the industry to keep rising. In a Sept. 30 report, it forecast that conventional DRAM contract prices will increase another 10% to 15% in the fourth quarter from the third. It expects NAND flash prices to climb 15% to 20%. The firm said increases are slowing but the market remains undersupplied. IDC expects PC buyers to pay more as well. The research firm forecast in June that average PC selling prices will rise 17% in 2026. TrendForce has also tracked a shift toward less memory per server. Cloud providers and OEMs have moved some servers from 96GB and 128GB memory modules to 32GB and 64GB modules since t

## Memory squeeze set to tighten through 2028, Micron says

DevFeed: [Memory squeeze set to tighten through 2028, Micron says](<https://devfeed.tech/articles/memory-squeeze-set-to-tighten-through-2028-micron-says-63218.md>)

Original publisher: [Read original article](<https://www.cio.com/article/4229625/memory-squeeze-set-to-tighten-through-2028-micron-says.html>)

Author: Gyana Swain

Published: 2026-10-01T13:58:09Z

Content type: news

Language: en

Sources: [CIO](<https://devfeed.tech/sources/cio.md>)

Topics: [memory price increases](<https://devfeed.tech/topics/memory-price-increases.md>), [DRAM price increase](<https://devfeed.tech/topics/dram-price-increase.md>), [nand flash price increase](<https://devfeed.tech/topics/nand-flash-price-increase.md>), [networking hardware prices](<https://devfeed.tech/topics/networking-hardware-prices.md>), [Product Management](<https://devfeed.tech/topics/product-management.md>)

Tags: [budgeting](<https://devfeed.tech/tags/budgeting.md>), [budgeting-data-center-it-management-servers](<https://devfeed.tech/tags/budgeting-data-center-it-management-servers.md>), [cloud](<https://devfeed.tech/tags/cloud.md>), [computing-capacity](<https://devfeed.tech/tags/computing-capacity.md>), [data-center](<https://devfeed.tech/tags/data-center.md>), [dram](<https://devfeed.tech/tags/dram.md>), [flash](<https://devfeed.tech/tags/flash.md>), [it-management](<https://devfeed.tech/tags/it-management.md>), [memory](<https://devfeed.tech/tags/memory.md>), [memory-shortage](<https://devfeed.tech/tags/memory-shortage.md>), [micron](<https://devfeed.tech/tags/micron.md>), [micron-technology](<https://devfeed.tech/tags/micron-technology.md>), [nand](<https://devfeed.tech/tags/nand.md>), [nand-flash](<https://devfeed.tech/tags/nand-flash.md>), [server](<https://devfeed.tech/tags/server.md>), [servers](<https://devfeed.tech/tags/servers.md>), [storage](<https://devfeed.tech/tags/storage.md>)

### AI overview

Micron expects memory and storage supply to remain tighter in 2027 and 2028 than in 2026, with DRAM and NAND prices rising and relief from new fabrication capacity taking time. CIOs are advised to secure pricing for known needs, weigh refresh delays against productivity and support risks, and reduce waste through more efficient memory provisioning and workload optimization.

### Source excerpt

The global memory shortage that has driven up the cost of servers, storage and PCs through 2026 will get worse in 2027 and 2028, according to memory maker Micron Technology. "We expect memory and storage supply-demand conditions to be much tighter in calendar 2027 and 2028 than they were in 2026," CEO Sanjay Mehrotra said in prepared remarks for the company's fiscal fourth-quarter earnings call. Even with new cleanroom space planned across the industry, "We do not have line of sight to when supply and demand will return to balance," he said. Earlier industry forecasts had expected the two to return to balance in 2028. Mehrotra added that new plants would not bring quick relief. "Production from new DRAM and NAND fabrication facilities takes time to ramp and gradually becomes more meaningful starting a few quarters after initial output," he said. Neil Shah, vice president of research at Counterpoint Research, said the outlook means CIOs "will have to be prudent about which equipment to upgrade and which to stretch to maintain cost efficiencies." Higher prices, less memory On the same call, CFO Mark Murphy said Micron's "inventory levels and supply remain extremely tight." Its DRAM prices rose by a percentage in the high teens in the fiscal fourth quarter, while NAND prices climbed about 30%, he said. Taiwan-based market research firm TrendForce expects prices across the industry to keep rising. In a Sept. 30 report, it forecast that conventional DRAM contract prices will increase another 10% to 15% in the fourth quarter from the third. It expects NAND flash prices to climb 15% to 20%. The firm said increases are slowing but the market remains undersupplied. IDC expects PC buyers to pay more as well. The research firm forecast in June that average PC selling prices will rise 17% in 2026. TrendForce has also tracked a shift toward less memory per server. Cloud providers and OEMs have moved some servers from 96GB and 128GB memory modules to 32GB and 64GB modules since t

## A 16GB iPod Nano 3G upgrade by Tucker Osman

DevFeed: [A 16GB iPod Nano 3G upgrade by Tucker Osman](<https://devfeed.tech/articles/a-16gb-ipod-nano-3g-upgrade-by-tucker-osman-61174.md>)

Original publisher: [Read original article](<https://blog.adafruit.com/2026/09/28/a-16gb-ipod-nano-3g-upgrade-by-tucker-osman/>)

Author: Anne Barela

Published: 2026-09-28T15:54:39Z

Content type: article

Language: en

Sources: [Adafruit Industries](<https://devfeed.tech/sources/adafruit-industries-makers-hackers-artists-designers-and-engineers.md>)

Topics: [Embedded Systems](<https://devfeed.tech/topics/embedded-systems.md>), [ESP32-C3](<https://devfeed.tech/topics/esp32-c3.md>), [Linux Kernel](<https://devfeed.tech/topics/linux-kernel.md>)

Tags: [apple](<https://devfeed.tech/tags/apple.md>), [block](<https://devfeed.tech/tags/block.md>), [bootloader](<https://devfeed.tech/tags/bootloader.md>), [chip](<https://devfeed.tech/tags/chip.md>), [ecc](<https://devfeed.tech/tags/ecc.md>), [electronics](<https://devfeed.tech/tags/electronics.md>), [firmware](<https://devfeed.tech/tags/firmware.md>), [hacks](<https://devfeed.tech/tags/hacks.md>), [ipod](<https://devfeed.tech/tags/ipod.md>), [memory](<https://devfeed.tech/tags/memory.md>), [nand](<https://devfeed.tech/tags/nand.md>), [nano](<https://devfeed.tech/tags/nano.md>), [reverse-engineering](<https://devfeed.tech/tags/reverse-engineering.md>), [upcycling](<https://devfeed.tech/tags/upcycling.md>), [upgrade](<https://devfeed.tech/tags/upgrade.md>)

### AI overview

A six-year project replaced an iPod Nano 3rd Generation's NAND chip with a 16GB chip. The upgrade required changes across the bootloader, disk mode, updater, and operating system firmware, plus a translator for the chip's larger page size. After correcting additional erase, ECC, and bad-block handling issues, the iPod reported 15GB and booted, synced, and played music and video.

### Source excerpt

A project write-up on tuckerosman.com documents a six year effort to put a 16GB NAND chip into an iPod Nano 3rd Generation. The Nano 3G was picked because it is the newest Nano whose NAND chip has legs instead of a BGA package. Desoldering the stock chip and fitting a larger one got a Red [...]

## Everybody's trying to figure out right laptop prices: Qualcomm exec on 'RAMageddon'

DevFeed: [Everybody's trying to figure out right laptop prices: Qualcomm exec on 'RAMageddon'](<https://devfeed.tech/articles/everybody-s-trying-to-figure-out-right-laptop-prices-qualcomm-exec-on-ramageddon-59659.md>)

Original publisher: [Read original article](<https://indianexpress.com/article/technology/tech-news-technology/everybodys-trying-to-figure-out-right-laptop-prices-qualcomm-exec-on-ramageddon-10893236/>)

Author: Anuj Bhatia

Published: 2026-09-25T04:43:15Z

Content type: news

Language: en

Sources: [Technology | The Indian Express](<https://devfeed.tech/sources/technology-the-indian-express.md>)

Topics: [pc](<https://devfeed.tech/topics/pc.md>), [Qualcomm](<https://devfeed.tech/topics/qualcomm.md>), [data](<https://devfeed.tech/topics/data.md>), [Artificial Intelligence](<https://devfeed.tech/topics/ai.md>)

Tags: [ai](<https://devfeed.tech/tags/ai.md>), [apple](<https://devfeed.tech/tags/apple.md>), [dell](<https://devfeed.tech/tags/dell.md>), [displays](<https://devfeed.tech/tags/displays.md>), [dram](<https://devfeed.tech/tags/dram.md>), [india](<https://devfeed.tech/tags/india.md>), [indian-express](<https://devfeed.tech/tags/indian-express.md>), [kedar-kondap-qualcomm](<https://devfeed.tech/tags/kedar-kondap-qualcomm.md>), [laptop](<https://devfeed.tech/tags/laptop.md>), [laptops-getting-expensive](<https://devfeed.tech/tags/laptops-getting-expensive.md>), [lcd](<https://devfeed.tech/tags/lcd.md>), [memory](<https://devfeed.tech/tags/memory.md>), [memory-chips](<https://devfeed.tech/tags/memory-chips.md>), [memory-crisis](<https://devfeed.tech/tags/memory-crisis.md>), [memory-shortage](<https://devfeed.tech/tags/memory-shortage.md>), [nand](<https://devfeed.tech/tags/nand.md>), [oled](<https://devfeed.tech/tags/oled.md>), [pc](<https://devfeed.tech/tags/pc.md>), [pricing](<https://devfeed.tech/tags/pricing.md>), [qualcomm](<https://devfeed.tech/tags/qualcomm.md>), [ram-prices](<https://devfeed.tech/tags/ram-prices.md>), [ramageddon](<https://devfeed.tech/tags/ramageddon.md>), [shortage](<https://devfeed.tech/tags/shortage.md>), [snapdragon](<https://devfeed.tech/tags/snapdragon.md>), [snapdragon-summit](<https://devfeed.tech/tags/snapdragon-summit.md>), [snapdragon-summit-2026](<https://devfeed.tech/tags/snapdragon-summit-2026.md>), [snapdragon-x-series](<https://devfeed.tech/tags/snapdragon-x-series.md>), [soaring-ram-costs](<https://devfeed.tech/tags/soaring-ram-costs.md>), [tech](<https://devfeed.tech/tags/tech.md>), [technology](<https://devfeed.tech/tags/technology.md>), [technology-tech](<https://devfeed.tech/tags/technology-tech.md>)

### AI overview

Qualcomm executive Kedar Kondap says the memory-chip shortage driven by AI data-centre expansion is reshaping laptop prices, displays, and the budget PC market. Manufacturers are weighing component changes and reduced memory configurations as they try to keep device prices balanced.

### Source excerpt

Qualcomm's Kedar Kondap says it is difficult to predict when the memory shortage, which is reshaping laptop prices, displays, and the budget PC market, will end.

## SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape

DevFeed: [SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape](<https://devfeed.tech/articles/semicon-india-2026-india-starts-packaging-chips-as-ecosystem-takes-shape-58585.md>)

Original publisher: [Read original article](<https://www.eetimes.com/semicon-india-2026-india-starts-packaging-chips-as-ecosystem-takes-shape/>)

Author: Yashasvini Razdan

Published: 2026-09-23T10:56:15Z

Content type: news

Language: en

Sources: [EE Times](<https://devfeed.tech/sources/ee-times.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>)

Tags: [2](<https://devfeed.tech/tags/2.md>), [2026](<https://devfeed.tech/tags/2026.md>), [analog](<https://devfeed.tech/tags/analog.md>), [analysis](<https://devfeed.tech/tags/analysis.md>), [assembly](<https://devfeed.tech/tags/assembly.md>), [batch](<https://devfeed.tech/tags/batch.md>), [business](<https://devfeed.tech/tags/business.md>), [capabilities](<https://devfeed.tech/tags/capabilities.md>), [capacity](<https://devfeed.tech/tags/capacity.md>), [ceo](<https://devfeed.tech/tags/ceo.md>), [chip](<https://devfeed.tech/tags/chip.md>), [chip-assembly](<https://devfeed.tech/tags/chip-assembly.md>), [chip-design](<https://devfeed.tech/tags/chip-design.md>), [chip-packaging](<https://devfeed.tech/tags/chip-packaging.md>), [community](<https://devfeed.tech/tags/community.md>), [design](<https://devfeed.tech/tags/design.md>), [designline](<https://devfeed.tech/tags/designline.md>), [devices](<https://devfeed.tech/tags/devices.md>), [digital](<https://devfeed.tech/tags/digital.md>), [dram](<https://devfeed.tech/tags/dram.md>), [eda](<https://devfeed.tech/tags/eda.md>), [education](<https://devfeed.tech/tags/education.md>), [ee-times](<https://devfeed.tech/tags/ee-times.md>), [ee-times-university](<https://devfeed.tech/tags/ee-times-university.md>), [eelife](<https://devfeed.tech/tags/eelife.md>), [eelive-electronic-design](<https://devfeed.tech/tags/eelive-electronic-design.md>), [eet](<https://devfeed.tech/tags/eet.md>), [electrical-engineering](<https://devfeed.tech/tags/electrical-engineering.md>), [electronic-components](<https://devfeed.tech/tags/electronic-components.md>), [electronic-engineering-times](<https://devfeed.tech/tags/electronic-engineering-times.md>), [electronics](<https://devfeed.tech/tags/electronics.md>), [embedded-systems](<https://devfeed.tech/tags/embedded-systems.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [engineering-talent](<https://devfeed.tech/tags/engineering-talent.md>), [fundamentals-courses](<https://devfeed.tech/tags/fundamentals-courses.md>), [india](<https://devfeed.tech/tags/india.md>), [indian-startups](<https://devfeed.tech/tags/indian-startups.md>), [learning](<https://devfeed.tech/tags/learning.md>), [manufacturing](<https://devfeed.tech/tags/manufacturing.md>), [mixed-signal](<https://devfeed.tech/tags/mixed-signal.md>), [nand](<https://devfeed.tech/tags/nand.md>), [news](<https://devfeed.tech/tags/news.md>), [opinion](<https://devfeed.tech/tags/opinion.md>), [part-search](<https://devfeed.tech/tags/part-search.md>), [product-search](<https://devfeed.tech/tags/product-search.md>), [production](<https://devfeed.tech/tags/production.md>), [semicon-india](<https://devfeed.tech/tags/semicon-india.md>), [semiconductors](<https://devfeed.tech/tags/semiconductors.md>), [software](<https://devfeed.tech/tags/software.md>), [tech-papers](<https://devfeed.tech/tags/tech-papers.md>), [technology](<https://devfeed.tech/tags/technology.md>), [uncategorized](<https://devfeed.tech/tags/uncategorized.md>), [video](<https://devfeed.tech/tags/video.md>)

### AI overview

India has five chip assembly and packaging plants in commercial production, while its first commercial wafer fab remains under construction. The ISM 2.0 program expands support for chip design, advanced packaging, equipment, materials, applied research, and talent, alongside new production and investment commitments.

### Source excerpt

India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times.

## IDC External Storage Tracker: $10.3 Billion in Q2 2026 as Server Market Tops $166 Billion on AI Demand

DevFeed: [IDC External Storage Tracker: $10.3 Billion in Q2 2026 as Server Market Tops $166 Billion on AI Demand](<https://devfeed.tech/articles/idc-external-storage-tracker-10-3-billion-in-q2-2026-as-server-market-tops-166-billion-on-ai-demand-57459.md>)

Original publisher: [Read original article](<https://www.storagereview.com/news/idc-external-storage-tracker-q2-2026-10-3-billion-as-server-market-tops-166-billion>)

Author: Harold Fritts

Published: 2026-09-21T15:00:25Z

Content type: news

Language: en

Sources: [StorageReview.com](<https://devfeed.tech/sources/storagereview-com.md>)

Topics: [idc](<https://devfeed.tech/topics/idc.md>), [Server](<https://devfeed.tech/topics/server.md>), [systems](<https://devfeed.tech/topics/systems.md>), [AI Infrastructure](<https://devfeed.tech/topics/ai-infrastructure.md>), [cloud-infrastructure](<https://devfeed.tech/topics/cloud-infrastructure.md>)

Tags: [2026](<https://devfeed.tech/tags/2026.md>), [ai-infrastructure](<https://devfeed.tech/tags/ai-infrastructure.md>), [compute](<https://devfeed.tech/tags/compute.md>), [dell](<https://devfeed.tech/tags/dell.md>), [deployments](<https://devfeed.tech/tags/deployments.md>), [dram](<https://devfeed.tech/tags/dram.md>), [enterprise](<https://devfeed.tech/tags/enterprise.md>), [enterprise-storage](<https://devfeed.tech/tags/enterprise-storage.md>), [hdd](<https://devfeed.tech/tags/hdd.md>), [hybrid](<https://devfeed.tech/tags/hybrid.md>), [idc](<https://devfeed.tech/tags/idc.md>), [nand](<https://devfeed.tech/tags/nand.md>), [server](<https://devfeed.tech/tags/server.md>), [ssd](<https://devfeed.tech/tags/ssd.md>), [storage](<https://devfeed.tech/tags/storage.md>)

### AI overview

IDC reports that external OEM enterprise storage systems revenue reached $10.3 billion in Q2 2026, up 33.6% year over year, while server revenue reached a record $166.3 billion, up 52.0%. The growth is attributed to infrastructure refreshes, anticipated component price increases, supply shortages, and strong demand from AI infrastructure deployments.

### Source excerpt

IDC's Worldwide Quarterly Enterprise Storage Systems Tracker shows the external OEM enterprise storage systems (ESS) market reached $10.3 billion in vendor revenue during the second quarter of 2026, up 33.6% year over year. It's the second-highest quarterly total in the tracker's history, trailing only Q4 2025, and the highest revenue ever recorded outside a fourth-quarter The post IDC External Storage Tracker: $10.3 Billion in Q2 2026 as Server Market Tops $166 Billion on AI Demand appeared first on StorageReview.com.

## China's DRAM Specialist CXMT Eyes NAND Flash Entry

DevFeed: [China's DRAM Specialist CXMT Eyes NAND Flash Entry](<https://devfeed.tech/articles/china-s-dram-specialist-cxmt-eyes-nand-flash-entry-55785.md>)

Original publisher: [Read original article](<https://www.eetimes.com/chinas-dram-specialist-cxmt-eyes-nand-flash-entry/>)

Author: Majeed Ahmad

Published: 2026-09-21T11:58:25Z

Content type: news

Language: en

Sources: [EE Times](<https://devfeed.tech/sources/ee-times.md>)

Topics: [data centers](<https://devfeed.tech/topics/data-centers.md>)

Tags: [analog](<https://devfeed.tech/tags/analog.md>), [analysis](<https://devfeed.tech/tags/analysis.md>), [business](<https://devfeed.tech/tags/business.md>), [china](<https://devfeed.tech/tags/china.md>), [community](<https://devfeed.tech/tags/community.md>), [data-centers](<https://devfeed.tech/tags/data-centers.md>), [designline](<https://devfeed.tech/tags/designline.md>), [digital](<https://devfeed.tech/tags/digital.md>), [dram](<https://devfeed.tech/tags/dram.md>), [education](<https://devfeed.tech/tags/education.md>), [ee-times](<https://devfeed.tech/tags/ee-times.md>), [ee-times-university](<https://devfeed.tech/tags/ee-times-university.md>), [eelife](<https://devfeed.tech/tags/eelife.md>), [eelive-electronic-design](<https://devfeed.tech/tags/eelive-electronic-design.md>), [eet](<https://devfeed.tech/tags/eet.md>), [electrical-engineering](<https://devfeed.tech/tags/electrical-engineering.md>), [electronic-components](<https://devfeed.tech/tags/electronic-components.md>), [electronic-engineering-times](<https://devfeed.tech/tags/electronic-engineering-times.md>), [electronics](<https://devfeed.tech/tags/electronics.md>), [embedded-systems](<https://devfeed.tech/tags/embedded-systems.md>), [flash-memory](<https://devfeed.tech/tags/flash-memory.md>), [fundamentals-courses](<https://devfeed.tech/tags/fundamentals-courses.md>), [learning](<https://devfeed.tech/tags/learning.md>), [memory](<https://devfeed.tech/tags/memory.md>), [memory-shortage](<https://devfeed.tech/tags/memory-shortage.md>), [micron](<https://devfeed.tech/tags/micron.md>), [mixed-signal](<https://devfeed.tech/tags/mixed-signal.md>), [nand](<https://devfeed.tech/tags/nand.md>), [nand-flash](<https://devfeed.tech/tags/nand-flash.md>), [news](<https://devfeed.tech/tags/news.md>), [opinion](<https://devfeed.tech/tags/opinion.md>), [part-search](<https://devfeed.tech/tags/part-search.md>), [product-search](<https://devfeed.tech/tags/product-search.md>), [samsung](<https://devfeed.tech/tags/samsung.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [semiconductors](<https://devfeed.tech/tags/semiconductors.md>), [servers](<https://devfeed.tech/tags/servers.md>), [sk-hynix](<https://devfeed.tech/tags/sk-hynix.md>), [software](<https://devfeed.tech/tags/software.md>), [ssds](<https://devfeed.tech/tags/ssds.md>), [storage](<https://devfeed.tech/tags/storage.md>), [supply-chain](<https://devfeed.tech/tags/supply-chain.md>), [supply-chain-distribution](<https://devfeed.tech/tags/supply-chain-distribution.md>), [tech-papers](<https://devfeed.tech/tags/tech-papers.md>), [technology](<https://devfeed.tech/tags/technology.md>), [video](<https://devfeed.tech/tags/video.md>)

### AI overview

ChangXin Memory Technologies is reportedly preparing to enter the NAND flash market as demand for SSDs for AI servers drives a global memory shortage. The move would expand CXMT beyond DRAM and increase competition with Yangtze Memory Technologies.

### Source excerpt

China's twin memory stars, CXMT and YMTC, move into each other's turf to capitalize on AI-driven storage shortages. The post China's DRAM Specialist CXMT Eyes NAND Flash Entry appeared first on EE Times.

## Kioxia XL1 CXL XL-FLASH NAND Device Shown

DevFeed: [Kioxia XL1 CXL XL-FLASH NAND Device Shown](<https://devfeed.tech/articles/kioxia-xl1-cxl-xl-flash-nand-device-shown-55278.md>)

Original publisher: [Read original article](<https://www.servethehome.com/kioxia-xl1-cxl-xl-flash-nand-device-shown/>)

Author: Eric Smith

Published: 2026-09-19T04:07:18Z

Content type: article

Language: en

Sources: [ServeTheHome](<https://devfeed.tech/sources/servethehome.md>)

Topics: [NVMe](<https://devfeed.tech/topics/nvme.md>), [Server](<https://devfeed.tech/topics/server.md>), [pcie](<https://devfeed.tech/topics/pcie.md>)

Tags: [cxl](<https://devfeed.tech/tags/cxl.md>), [cxl-2-0](<https://devfeed.tech/tags/cxl-2-0.md>), [device](<https://devfeed.tech/tags/device.md>), [dram](<https://devfeed.tech/tags/dram.md>), [kioxia](<https://devfeed.tech/tags/kioxia.md>), [latency](<https://devfeed.tech/tags/latency.md>), [memory](<https://devfeed.tech/tags/memory.md>), [nand](<https://devfeed.tech/tags/nand.md>), [nvme](<https://devfeed.tech/tags/nvme.md>), [pcie](<https://devfeed.tech/tags/pcie.md>), [servers](<https://devfeed.tech/tags/servers.md>), [slc](<https://devfeed.tech/tags/slc.md>), [ssds](<https://devfeed.tech/tags/ssds.md>), [storage](<https://devfeed.tech/tags/storage.md>)

### AI overview

The article examines Kioxia's XL1, a 512GB CXL 2.0 Type 3 memory-expansion device using XL-FLASH Generation 2 NAND. It describes the device's performance and its potential use alongside DRAM for colder memory regions to reduce costs.

### Source excerpt

The Kioxia XL1 is an XL-FLASH Generation 2 NAND device that is attached to a system as a 512GB memory expansion device via CXL The post Kioxia XL1 CXL XL-FLASH NAND Device Shown appeared first on ServeTheHome.

## AI's Storage Problem Is a Packaging Problem

DevFeed: [AI's Storage Problem Is a Packaging Problem](<https://devfeed.tech/articles/ai-s-storage-problem-is-a-packaging-problem-52600.md>)

Original publisher: [Read original article](<https://semiengineering.com/ais-storage-problem-is-a-packaging-problem/>)

Author: Chiung Lee

Published: 2026-09-17T07:05:40Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Artificial Intelligence](<https://devfeed.tech/topics/ai.md>), [cloud-infrastructure](<https://devfeed.tech/topics/cloud-infrastructure.md>), [data centers](<https://devfeed.tech/topics/data-centers.md>), [data](<https://devfeed.tech/topics/data.md>)

Tags: [3d-nand](<https://devfeed.tech/tags/3d-nand.md>), [advanced-packaging](<https://devfeed.tech/tags/advanced-packaging.md>), [ai](<https://devfeed.tech/tags/ai.md>), [ai-models](<https://devfeed.tech/tags/ai-models.md>), [amkor](<https://devfeed.tech/tags/amkor.md>), [blogs-md](<https://devfeed.tech/tags/blogs-md.md>), [chip-package-system](<https://devfeed.tech/tags/chip-package-system.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [hybrid-bonding](<https://devfeed.tech/tags/hybrid-bonding.md>), [inference](<https://devfeed.tech/tags/inference.md>), [infrastructure](<https://devfeed.tech/tags/infrastructure.md>), [manufacturing-packaging-and-materials](<https://devfeed.tech/tags/manufacturing-packaging-and-materials.md>), [nand](<https://devfeed.tech/tags/nand.md>), [osats](<https://devfeed.tech/tags/osats.md>), [packaging](<https://devfeed.tech/tags/packaging.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [ssds](<https://devfeed.tech/tags/ssds.md>), [storage](<https://devfeed.tech/tags/storage.md>)

### AI overview

The article argues that AI-driven data growth is making storage infrastructure a central system constraint. It examines how thinner dies, taller memory stacks, hybrid bonding, NAND flash, DRAM, HBM, and advanced packaging are being used to support expanding AI, data-center, device, and automotive workloads.

### Source excerpt

How thinner dies, taller stacks, and hybrid bonding are carrying NAND into the AI era. The post AI's Storage Problem Is a Packaging Problem appeared first on Semiconductor Engineering.

## A Practical Guide to Embedded Linux Logging

DevFeed: [A Practical Guide to Embedded Linux Logging](<https://devfeed.tech/articles/a-practical-guide-to-embedded-linux-logging-47298.md>)

Original publisher: [Read original article](<https://interrupt.memfault.com/blog/linux-logging>)

Author: Grace Henderson

Published: 2026-08-13T00:00:00Z

Content type: tutorial

Language: en

Sources: [Interrupt](<https://devfeed.tech/sources/interrupt.md>)

Topics: [Embedded Systems](<https://devfeed.tech/topics/embedded-systems.md>), [Logging](<https://devfeed.tech/topics/logging.md>), [log management](<https://devfeed.tech/topics/log-management.md>), [Linux](<https://devfeed.tech/topics/linux.md>), [debugging](<https://devfeed.tech/topics/debugging.md>), [Compression](<https://devfeed.tech/topics/compression.md>)

Tags: [architecture](<https://devfeed.tech/tags/architecture.md>), [article](<https://devfeed.tech/tags/article.md>), [compression](<https://devfeed.tech/tags/compression.md>), [compute](<https://devfeed.tech/tags/compute.md>), [debugging](<https://devfeed.tech/tags/debugging.md>), [device](<https://devfeed.tech/tags/device.md>), [embedded](<https://devfeed.tech/tags/embedded.md>), [guide](<https://devfeed.tech/tags/guide.md>), [linux](<https://devfeed.tech/tags/linux.md>), [logging](<https://devfeed.tech/tags/logging.md>), [memory](<https://devfeed.tech/tags/memory.md>), [nand](<https://devfeed.tech/tags/nand.md>), [performance](<https://devfeed.tech/tags/performance.md>), [practical](<https://devfeed.tech/tags/practical.md>), [storage](<https://devfeed.tech/tags/storage.md>), [tradeoffs](<https://devfeed.tech/tags/tradeoffs.md>)

### AI overview

A practical guide to embedded Linux logging that examines logging platforms and the tradeoffs among storage media, compression, and verbosity. It explains how logging affects debugging, system performance, memory writes, and flash lifetime on resource-constrained devices.

### Source excerpt

This article will walk through various types of embedded Linux logging platforms and consider tradeoffs between logging storage media, compression, and verbosity to enhance device debugging without eating into your limited resource budget. Continue reading...