# optical interconnects

Published articles for optical interconnects.

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## AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers

DevFeed: [AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers](<https://devfeed.tech/articles/ai-drives-larger-denser-packaging-raising-new-challenges-for-equipment-makers-62490.md>)

Original publisher: [Read original article](<https://www.eetimes.com/ai-drives-larger-denser-packaging-raising-new-challenges-for-equipment-makers/>)

Author: Susan Hong

Published: 2026-09-30T08:55:36Z

Content type: news

Language: en

Sources: [EE Times](<https://devfeed.tech/sources/ee-times.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>), [AI Context Switching](<https://devfeed.tech/topics/ai-context-switching.md>), [nbdev](<https://devfeed.tech/topics/nbdev.md>)

Tags: [3d-silicon-stacking](<https://devfeed.tech/tags/3d-silicon-stacking.md>), [advanced-packaging](<https://devfeed.tech/tags/advanced-packaging.md>), [ai](<https://devfeed.tech/tags/ai.md>), [analog](<https://devfeed.tech/tags/analog.md>), [analysis](<https://devfeed.tech/tags/analysis.md>), [asia-watch](<https://devfeed.tech/tags/asia-watch.md>), [business](<https://devfeed.tech/tags/business.md>), [chiplets](<https://devfeed.tech/tags/chiplets.md>), [community](<https://devfeed.tech/tags/community.md>), [designline](<https://devfeed.tech/tags/designline.md>), [digital](<https://devfeed.tech/tags/digital.md>), [education](<https://devfeed.tech/tags/education.md>), [ee-times](<https://devfeed.tech/tags/ee-times.md>), [ee-times-university](<https://devfeed.tech/tags/ee-times-university.md>), [eelife](<https://devfeed.tech/tags/eelife.md>), [eelive-electronic-design](<https://devfeed.tech/tags/eelive-electronic-design.md>), [eet](<https://devfeed.tech/tags/eet.md>), [electrical-engineering](<https://devfeed.tech/tags/electrical-engineering.md>), [electronic-components](<https://devfeed.tech/tags/electronic-components.md>), [electronic-engineering-times](<https://devfeed.tech/tags/electronic-engineering-times.md>), [electronics](<https://devfeed.tech/tags/electronics.md>), [embedded-systems](<https://devfeed.tech/tags/embedded-systems.md>), [fundamentals-courses](<https://devfeed.tech/tags/fundamentals-courses.md>), [high-bandwidth-memory](<https://devfeed.tech/tags/high-bandwidth-memory.md>), [hybrid-bonding](<https://devfeed.tech/tags/hybrid-bonding.md>), [inspection](<https://devfeed.tech/tags/inspection.md>), [learning](<https://devfeed.tech/tags/learning.md>), [metrology](<https://devfeed.tech/tags/metrology.md>), [mixed-signal](<https://devfeed.tech/tags/mixed-signal.md>), [news](<https://devfeed.tech/tags/news.md>), [opinion](<https://devfeed.tech/tags/opinion.md>), [optical-interconnects](<https://devfeed.tech/tags/optical-interconnects.md>), [part-search](<https://devfeed.tech/tags/part-search.md>), [product-search](<https://devfeed.tech/tags/product-search.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [semiconductors](<https://devfeed.tech/tags/semiconductors.md>), [software](<https://devfeed.tech/tags/software.md>), [tech-papers](<https://devfeed.tech/tags/tech-papers.md>), [technology](<https://devfeed.tech/tags/technology.md>), [transistor-scaling](<https://devfeed.tech/tags/transistor-scaling.md>), [video](<https://devfeed.tech/tags/video.md>)

### AI overview

At A*STAR's Innovate Together 2026, semiconductor industry experts discussed how AI computing demand is driving larger packages and denser interconnects. They highlighted process-control challenges for hybrid bonding, including surface quality, particles and materials, while noting that thermal compression bonding remains a mature, lower-cost option likely to coexist with hybrid bonding in some applications.

### Source excerpt

At A*STAR's Innovate Together 2026, industry experts explored packaging, hybrid bonding, optical interconnects, and process control for AI. The post AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers appeared first on EE Times.