# power delivery

Published articles for power delivery.

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## Beyond Scaling: The Growing Role Of Materials Innovation In Semiconductor Manufacturing

DevFeed: [Beyond Scaling: The Growing Role Of Materials Innovation In Semiconductor Manufacturing](<https://devfeed.tech/articles/beyond-scaling-the-growing-role-of-materials-innovation-in-semiconductor-manufacturing-52601.md>)

Original publisher: [Read original article](<https://semiengineering.com/beyond-scaling-the-growing-role-of-materials-innovation-in-semiconductor-manufacturing/>)

Author: Hideaki Okamoto

Published: 2026-09-17T07:06:17Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Scalability](<https://devfeed.tech/topics/scalability.md>), [Simulation](<https://devfeed.tech/topics/simulation.md>), [Artificial Intelligence](<https://devfeed.tech/topics/ai.md>), [data](<https://devfeed.tech/topics/data.md>)

Tags: [ai](<https://devfeed.tech/tags/ai.md>), [blogs-md](<https://devfeed.tech/tags/blogs-md.md>), [compute](<https://devfeed.tech/tags/compute.md>), [gallium-nitride](<https://devfeed.tech/tags/gallium-nitride.md>), [gan](<https://devfeed.tech/tags/gan.md>), [manufacturing-packaging-and-materials](<https://devfeed.tech/tags/manufacturing-packaging-and-materials.md>), [materials](<https://devfeed.tech/tags/materials.md>), [materials-innovation](<https://devfeed.tech/tags/materials-innovation.md>), [mitsubishi-chemical-group](<https://devfeed.tech/tags/mitsubishi-chemical-group.md>), [optics](<https://devfeed.tech/tags/optics.md>), [power-delivery](<https://devfeed.tech/tags/power-delivery.md>), [power-semiconductors](<https://devfeed.tech/tags/power-semiconductors.md>), [scaling](<https://devfeed.tech/tags/scaling.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [semiconductor-manufacturing](<https://devfeed.tech/tags/semiconductor-manufacturing.md>), [simulation](<https://devfeed.tech/tags/simulation.md>)

### AI overview

The article examines how semiconductor manufacturing is becoming increasingly dependent on materials innovation as advanced-node scaling faces limits in interconnects, power delivery, and thermal management. It highlights computational screening and deeper co-development as ways to accelerate the movement of new materials from laboratory research into high-volume manufacturing.

### Source excerpt

Expanding computational capabilities and deeper co-development are changing how materials move from lab to fab. The post Beyond Scaling: The Growing Role Of Materials Innovation In Semiconductor Manufacturing appeared first on Semiconductor Engineering.

## Driving Power Delivery Innovations For The AI Data Center

DevFeed: [Driving Power Delivery Innovations For The AI Data Center](<https://devfeed.tech/articles/driving-power-delivery-innovations-for-the-ai-data-center-52603.md>)

Original publisher: [Read original article](<https://semiengineering.com/driving-power-delivery-innovations-for-the-ai-data-center/>)

Author: Intel Foundry

Published: 2026-09-17T07:04:55Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [data centers](<https://devfeed.tech/topics/data-centers.md>), [Computing](<https://devfeed.tech/topics/computing.md>), [Scalability](<https://devfeed.tech/topics/scalability.md>), [High-Performance Computing](<https://devfeed.tech/topics/high-performance-computing.md>), [Artificial Intelligence](<https://devfeed.tech/topics/ai.md>), [systems](<https://devfeed.tech/topics/systems.md>), [intel](<https://devfeed.tech/topics/intel.md>)

Tags: [advanced](<https://devfeed.tech/tags/advanced.md>), [ai](<https://devfeed.tech/tags/ai.md>), [ai-data-centers](<https://devfeed.tech/tags/ai-data-centers.md>), [backside-power-delivery](<https://devfeed.tech/tags/backside-power-delivery.md>), [bpd](<https://devfeed.tech/tags/bpd.md>), [chip](<https://devfeed.tech/tags/chip.md>), [complexity](<https://devfeed.tech/tags/complexity.md>), [computing](<https://devfeed.tech/tags/computing.md>), [critical](<https://devfeed.tech/tags/critical.md>), [data-center](<https://devfeed.tech/tags/data-center.md>), [efficiency](<https://devfeed.tech/tags/efficiency.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [foundry](<https://devfeed.tech/tags/foundry.md>), [high-performance](<https://devfeed.tech/tags/high-performance.md>), [high-performance-computing](<https://devfeed.tech/tags/high-performance-computing.md>), [integrated-voltage-regulator](<https://devfeed.tech/tags/integrated-voltage-regulator.md>), [intel-foundry](<https://devfeed.tech/tags/intel-foundry.md>), [ivr](<https://devfeed.tech/tags/ivr.md>), [manufacturing-packaging-and-materials](<https://devfeed.tech/tags/manufacturing-packaging-and-materials.md>), [performance](<https://devfeed.tech/tags/performance.md>), [power](<https://devfeed.tech/tags/power.md>), [power-delivery](<https://devfeed.tech/tags/power-delivery.md>), [reliability](<https://devfeed.tech/tags/reliability.md>), [scale](<https://devfeed.tech/tags/scale.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [systems](<https://devfeed.tech/tags/systems.md>), [whitepapers](<https://devfeed.tech/tags/whitepapers.md>)

### AI overview

This paper examines power delivery challenges in AI and high-performance computing systems as rising current demands strain traditional power delivery networks. It discusses Intel Foundry innovations including backside power delivery, silicon capacitors, and integrated voltage regulators across accelerator, package, rack, and data center levels.

### Source excerpt

As AI systems scale, advanced power delivery innovations are becoming critical to performance, efficiency and reliability. The post Driving Power Delivery Innovations For The AI Data Center appeared first on Semiconductor Engineering.