# Research: LPHP

Published articles for Research: LPHP.

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## Chip Industry Technical Paper Roundup: Sept. 29

DevFeed: [Chip Industry Technical Paper Roundup: Sept. 29](<https://devfeed.tech/articles/chip-industry-technical-paper-roundup-sept-29-61792.md>)

Original publisher: [Read original article](<https://semiengineering.com/chip-industry-technical-paper-roundup-sept-29/>)

Author: Linda Christensen

Published: 2026-09-29T07:01:34Z

Content type: news

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>), [rowhammer](<https://devfeed.tech/topics/rowhammer.md>), [Large Language Model](<https://devfeed.tech/topics/llm.md>)

Tags: [applied-materials](<https://devfeed.tech/tags/applied-materials.md>), [carnegie-mellon-university](<https://devfeed.tech/tags/carnegie-mellon-university.md>), [georgia-tech](<https://devfeed.tech/tags/georgia-tech.md>), [marist-university](<https://devfeed.tech/tags/marist-university.md>), [mit](<https://devfeed.tech/tags/mit.md>), [nvidia-research](<https://devfeed.tech/tags/nvidia-research.md>), [purdue-university](<https://devfeed.tech/tags/purdue-university.md>), [research](<https://devfeed.tech/tags/research.md>), [research-lphp](<https://devfeed.tech/tags/research-lphp.md>), [semiconductor-research](<https://devfeed.tech/tags/semiconductor-research.md>), [stanford-university](<https://devfeed.tech/tags/stanford-university.md>), [technical-papers](<https://devfeed.tech/tags/technical-papers.md>), [texas-a-m-university](<https://devfeed.tech/tags/texas-a-m-university.md>), [tu-munich](<https://devfeed.tech/tags/tu-munich.md>), [ucla](<https://devfeed.tech/tags/ucla.md>), [university-of-florida](<https://devfeed.tech/tags/university-of-florida.md>), [university-of-minnesota](<https://devfeed.tech/tags/university-of-minnesota.md>), [university-of-modena-and-reggio-emilia](<https://devfeed.tech/tags/university-of-modena-and-reggio-emilia.md>), [university-of-toronto](<https://devfeed.tech/tags/university-of-toronto.md>), [university-of-wisconsin-madison](<https://devfeed.tech/tags/university-of-wisconsin-madison.md>)

### AI overview

This technical paper roundup covers semiconductor research, including transistor technologies, power delivery, GPU Rowhammer attacks, RTL Trojan localization, memory access for LLM inference, and agent-driven chip design using HLS.

### Source excerpt

A7 CFET vs. A10 NSFETs; wafer-scale sub-5nm MoS₂ transistors; multi-kW power delivery for 3D HI; copper microstructure and TSV residual stress; Rowhammer attacks on GPUs; gate-level RTL Trojan localization; concurrent HBM and host-memory access for LLM inference; agent-driven chip design using HLS. The post Chip Industry Technical Paper Roundup: Sept. 29 appeared first on Semiconductor Engineering.

## Chip Industry Technical Paper Roundup: Sept. 22

DevFeed: [Chip Industry Technical Paper Roundup: Sept. 22](<https://devfeed.tech/articles/chip-industry-technical-paper-roundup-sept-22-57972.md>)

Original publisher: [Read original article](<https://semiengineering.com/chip-industry-technical-paper-roundup-sept-22/>)

Author: Linda Christensen

Published: 2026-09-22T07:01:29Z

Content type: article

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Computing](<https://devfeed.tech/topics/computing.md>), [Artificial Intelligence](<https://devfeed.tech/topics/ai.md>), [Orchestration](<https://devfeed.tech/topics/orchestration.md>), [Large Language Model](<https://devfeed.tech/topics/llm.md>)

Tags: [eda](<https://devfeed.tech/tags/eda.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [heidelberg-university](<https://devfeed.tech/tags/heidelberg-university.md>), [interconnects](<https://devfeed.tech/tags/interconnects.md>), [layout](<https://devfeed.tech/tags/layout.md>), [llm](<https://devfeed.tech/tags/llm.md>), [new-york-university](<https://devfeed.tech/tags/new-york-university.md>), [papers](<https://devfeed.tech/tags/papers.md>), [peking-university](<https://devfeed.tech/tags/peking-university.md>), [purdue-university](<https://devfeed.tech/tags/purdue-university.md>), [research](<https://devfeed.tech/tags/research.md>), [research-lphp](<https://devfeed.tech/tags/research-lphp.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [semiconductor-research](<https://devfeed.tech/tags/semiconductor-research.md>), [shanghaitech-university](<https://devfeed.tech/tags/shanghaitech-university.md>), [technical](<https://devfeed.tech/tags/technical.md>), [technical-papers](<https://devfeed.tech/tags/technical-papers.md>), [tu-munich](<https://devfeed.tech/tags/tu-munich.md>), [university-of-edinburgh](<https://devfeed.tech/tags/university-of-edinburgh.md>), [university-of-michigan](<https://devfeed.tech/tags/university-of-michigan.md>), [university-of-technology-sydney](<https://devfeed.tech/tags/university-of-technology-sydney.md>)

### AI overview

A roundup of recently added semiconductor engineering papers covering thermal modeling for 2.5D and 3D integrated circuits, chiplet and AI accelerator co-design, agentic design-rule-check repair, reinforcement learning for dense-layout routing, LLM orchestration for digital EDA, and neuromorphic-computing interconnects.

### Source excerpt

AI thermal modeling for 2.5D/3D ICs; chiplet and AI accelerator co-design; BEOL thermal conductivity; agentic DRC repair; RL for dense-layout routing; LLM orchestration for digital EDA; chiplet interconnects for neuromorphic computing. The post Chip Industry Technical Paper Roundup: Sept. 22 appeared first on Semiconductor Engineering.