# Zeiss

Published articles for Zeiss.

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## Foundries And OSATs Increasingly Overlap

DevFeed: [Foundries And OSATs Increasingly Overlap](<https://devfeed.tech/articles/foundries-and-osats-increasingly-overlap-95100.md>)

Original publisher: [Read original article](<https://semiengineering.com/foundries-and-osats-increasingly-overlap/>)

Author: Bryon Moyer

Published: 2026-10-22T07:01:03Z

Content type: news

Language: en

Sources: [Semiconductor Engineering](<https://devfeed.tech/sources/semiconductor-engineering.md>)

Topics: [Chip design](<https://devfeed.tech/topics/chip-design.md>), [Finance](<https://devfeed.tech/topics/finance.md>), [tsmc](<https://devfeed.tech/topics/tsmc.md>), [High-Performance Computing](<https://devfeed.tech/topics/high-performance-computing.md>)

Tags: [2-5d](<https://devfeed.tech/tags/2-5d.md>), [2-5d-integration](<https://devfeed.tech/tags/2-5d-integration.md>), [2025](<https://devfeed.tech/tags/2025.md>), [2026](<https://devfeed.tech/tags/2026.md>), [3d](<https://devfeed.tech/tags/3d.md>), [added](<https://devfeed.tech/tags/added.md>), [adoption](<https://devfeed.tech/tags/adoption.md>), [advanced](<https://devfeed.tech/tags/advanced.md>), [advanced-packaging](<https://devfeed.tech/tags/advanced-packaging.md>), [ai](<https://devfeed.tech/tags/ai.md>), [alignment](<https://devfeed.tech/tags/alignment.md>), [all](<https://devfeed.tech/tags/all.md>), [amkor](<https://devfeed.tech/tags/amkor.md>), [ase-group](<https://devfeed.tech/tags/ase-group.md>), [brewer-science](<https://devfeed.tech/tags/brewer-science.md>), [capacity](<https://devfeed.tech/tags/capacity.md>), [engineering](<https://devfeed.tech/tags/engineering.md>), [ev-group](<https://devfeed.tech/tags/ev-group.md>), [first](<https://devfeed.tech/tags/first.md>), [foundry](<https://devfeed.tech/tags/foundry.md>), [growth](<https://devfeed.tech/tags/growth.md>), [hybrid-bonding](<https://devfeed.tech/tags/hybrid-bonding.md>), [intel-foundry](<https://devfeed.tech/tags/intel-foundry.md>), [manufacturing-packaging-and-materials](<https://devfeed.tech/tags/manufacturing-packaging-and-materials.md>), [mitsubishi-chemical](<https://devfeed.tech/tags/mitsubishi-chemical.md>), [osat](<https://devfeed.tech/tags/osat.md>), [osats](<https://devfeed.tech/tags/osats.md>), [overlap](<https://devfeed.tech/tags/overlap.md>), [packaging](<https://devfeed.tech/tags/packaging.md>), [panel](<https://devfeed.tech/tags/panel.md>), [semiconductor](<https://devfeed.tech/tags/semiconductor.md>), [silvaco](<https://devfeed.tech/tags/silvaco.md>), [top-stories](<https://devfeed.tech/tags/top-stories.md>), [zeiss](<https://devfeed.tech/tags/zeiss.md>)

### AI overview

Advanced packaging growth and foundry capacity constraints are shifting some backend work toward OSATs, blurring the traditional division between wafer fabrication and assembly. OSATs are adding capabilities for 2.5D integration and panel packaging, while foundries prioritize newer-node fabrication and may offload legacy or overflow work. This shift brings wafer-fab-style lithography and materials into packaging as finer-pitch redistribution layers demand more precise patterning and alignment. Foundries still dominate high-volume hybrid bonding; OSAT adoption may grow if demand exceeds foundry capacity and processes mature. OSATs must invest in new equipment, with returns depending on utilization and customer commitments. Their spillover role also leaves them more exposed to changing demand, according to the source.

### Source excerpt

Advanced packaging growth and capacity constraints are pushing more onto OSATs. The post Foundries And OSATs Increasingly Overlap appeared first on Semiconductor Engineering.